Yield in Electronics Manufacturing

These flashcards cover essential vocabulary and definitions related to yield in electronics manufacturing, as presented in the lecture notes.

Yield

The measure of how many devices are functional compared to the total produced.

Cleanroom

A controlled environment designed to minimize particulate contamination.

Moore's Law

The observation that the number of transistors on a microchip doubles approximately every two years.

Defect density

The number of defects per unit area in a semiconductor or manufactured PCB.

Photolithography

A process used in PCB manufacturing to transfer patterns onto a substrate.

Soldering processes

Methods used to join components on PCBs using a molten material.

Contamination control

Methods aimed at preventing contamination in the manufacturing process.

Inspection and test

Processes used to identify defects at various stages of manufacturing.

HEPA filter

High Efficiency Particulate Air filter used in cleanrooms to remove particles from the air.

PCB

Printed Circuit Board, used to mechanically support and electrically connect electronic components.

Point defects

Localized defects such as short circuits or open circuits in a semiconductor.

Integrated Circuit

A set of electronic circuits on a small flat chip of semiconductor material.

Transistor count

The number of transistors within a microprocessor, indicating complexity and capability.

Airlocks

Sealed chambers used in cleanrooms to limit airflow and contamination.

Yield formula (exponential distribution)

Yield = e^(-AD), where A is device area and D is defect density.

Overall yield

The product of the yield from each individual manufacturing step.

Functional test

A test that verifies the device performs its designed functions.

Level zero testing

Testing conducted after wafer fabrication to identify good die.

Assembly yield

The overall yield achieved after assembling components onto the PCB.

Contaminants

Unwanted substances that can negatively affect manufacturing quality.

Precision manufacturing

Techniques used to ensure high accuracy in the creation of parts or devices.

Clean materials

Materials used in construction that meet cleanliness standards for use in cleanrooms.

Particle size impact

Contaminants larger than approximately 10% of feature size may cause failure.

Interconnection requirements

Standards for connecting components in electronic devices.

Design rules

Guidelines for the layout and manufacturing of PCB designs.

Rework opportunities

Possibilities to repair or rework defective components or assemblies.

Electrical test

Tests conducted to ensure that all electrical parameters of a device are met.

Raw material cleanliness

The requirement that all materials entering production are clean.

Performance metrics

Quantitative measures used to assess manufacturing and testing efficiency.

Manufacturing faults

Deficiencies or errors occurring during the production of components.

Components types

Various types of electronic elements used in fabrication, such as resistors and capacitors.

Assembly processes

The systematic methods used for putting together components onto a PCB.

Testing stages

Different points in the production cycle at which inspection and testing occur.

Electromechanical systems

Devices that combine electrical and mechanical processes for functionality.

Cost per component

Economic measure indicating the manufacturing cost associated with each component.