EGN 3365 Exam 2

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77 Terms

1
The given stress-strain graph represents?
The given stress-strain graph represents?
Elastic then plastic deformation
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2
What does the figure represent?
What does the figure represent?
Simple compression
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3
Which material has the highest toughness?
Which material has the highest toughness?
Material 2
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4
For an engineering strain of 1, calculate percentage elongation (ductility) of the specimen?
100
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5
A specimen of copper having a rectangular cross-section 15.2 mm X 19.1 mm  is pulled in tension with 44,500 N  force, producing only elastic deformation. Calculate the resulting strain. ( Elastic modulus of copper = 110 GPa)
A specimen of copper having a rectangular cross-section 15.2 mm X 19.1 mm  is pulled in tension with 44,500 N  force, producing only elastic deformation. Calculate the resulting strain. ( Elastic modulus of copper = 110 GPa)
1\.39 x 10^-3
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6
Ductility is the amount of plastic deformation at failure.

From the given graph below, determine which line represent a material with high ductility and which line represent a material with low ductility.
Ductility is the amount of plastic deformation at failure.

From the given graph below, determine which line represent a material with high ductility and which line represent a material with low ductility.
Blue line: Low ductility.

Green line: High ductility.
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7
For some metal alloy, the true stress of 345 MPa produces a plastic true strain of 0.02. How much does a specimen of this material elongate when true stress of 415 MPa is applied if the original length is 500 mm? Assume a value of 0.22 for the strain-hardening exponent, n.
For some metal alloy, the true stress of 345 MPa produces a plastic true strain of 0.02. How much does a specimen of this material elongate when true stress of 415 MPa is applied if the original length is 500 mm? Assume a value of 0.22 for the strain-hardening exponent, n.
23\.7mm
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8
Poisson's ratio for metals, ceramics and polymers is in the range:
0\.15 < v
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9
Deformation of a sample to an engineering strain of 2 means that the sample is ___________ its original length.

A. Half

B. Twice

C. Three times

D. 2% longer than
Three times
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10
What best describes the figure?

A. Not an example of diffusion

B. Left: before diffusion, right: after diffusion

C. Left: after diffusion, right: before diffusion

D. None of the above
What best describes the figure?

A. Not an example of diffusion

B. Left: before diffusion, right: after diffusion

C. Left: after diffusion, right: before diffusion

D. None of the above
Left: before diffusion; right: after diffusion
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11
What is diffusion
Mass transport by atomic motion
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12
Atoms tend to _____________ from regions of _____________ concentration to regions of _____________ concentration.
Migrate, high, low
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13
What is self-diffusion?
Migration of host atoms in pure metals
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14
What is the derivation of the equation relating the diffusion coefficients at two temperatures T1 and T2, given that:
What is the derivation of the equation relating the diffusion coefficients at two temperatures T1 and T2, given that:
D₂ = D₁exp \[-Qd/R(1/T2-1/T2)\]
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15
At 300°C the diffusion coefficient and activation energy for Cu in Si are

D₁ (300°C) = 7.8 × 10⁻⁻¹¹ m²/s

Qd = 41.5 kJ/mol

Compute the diffusion coefficient D₂ at 400°C.
28\.46 × 10⁻⁻¹¹ m²/s
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16
Non-steady state diffusion is a function of:
Time and position
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17
Fick’s first law of diffusion is applicable to
Steady state diffusion
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18
What’s Fick’s second law of diffusion?
dC/dt = D d²C/dx²
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19
What's Fick’s first law of diffusion?
J = −D dC/dx
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20
What’s the relationship between the diffusion coefficient and temperature?
Increases with increasing temp
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21
What is interdiffusion?
Diffusion of atoms of one material into another material
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22
Diffusion rate of vacancy diffusion depends on
Number of vacancies, activation energy
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23
interstitial diffusion
smaller atoms diffuse between adjacent atoms, faster than vacancy diffusion
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24
Case hardening is an example of _________ diffusion
Interstitial
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25
case hardening
outer surface is hardened by diffusing carbon atoms into surface
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26
Doping
adding impurities to a semiconductor to increase conductivity
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27
Process of doping
  1. P rich layers on surface

  2. Heat it

  3. Doped semiconductor regions

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28
Diffusion is faster for
open crystal structures, materials with secondary bonding, smaller diffusing atoms, lower density materials
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29
Tensile load (pulling)
If a specimen is being elongated or extended
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30
Compressive load (pushing)
Specimen is compressed or contracted
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31
Deformation
Change in dimension
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32
shear forces
Parallel to cross sectional area
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33
Plastic deformation
permanent change in shape by bending and folding
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34
Elastic deformation
material returns to original state when stress is removed
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35
Common states of stress
Simple tension, torsion, simple compression, bi-axial tension, hydrostatic compression
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36
Yield strength
point where the material begins to plastically deform
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37
Toughness
the ability of a material to resist fracture
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38
Hardness
resistance to localized surface deformation and compressive stresses
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39
Resilience
Ability of a material to store energy
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40
Ductility
amount of plastic deformation at failure
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41
Engineering stress
tensile, shear
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42
Engineering strain
tensile, lateral, shear
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43
Percent elongation
the total percent increase in length of a specimen during the tensile test
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44
Dislocation
A defect where atoms are misaligned around it
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45
Edge dislocation
extra half plane of atoms inserted into a crystal structure
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46
Dislocation line
The line where dislocations happen
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47
Screw dislocation
lattice plane shifts similar to a spiral staircase
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48
Burgers vector
measure of lattice distortion
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49
Twin boundary
a reflection of atom positions across the twin plane
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50
Solidification
Result of casting molten material
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51
Grain boundaries
Regions between grains (crystals)
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52
Point defects
vacancy, interstitial atoms, substitutional atoms
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53
Vacancies are
vacant atomic sites
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54
Dislocations move when
Stresses are applied
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55
A catalyst \____________ the rate is a chemical reaction without being consumed
Increases
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56
Dislocation types include
Edge, screw, and mixed
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57
two diffusion mechanisms
vacancy and interstitial
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58
The applied mechanical force is normalized to
Stress
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59
The degree of deformation is normalized to
strain
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60
Elastic deformation is
nonpermanent and reversible
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61
Plastic deformation is
permanent and nonrecoverable
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62
Stiffness
a material's resistance to elastic deformation
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63
Strength
A materials resistance to plastic deformation
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64
In an optical microscope, grain boundaries appear as white lines after the surface is prepared by etching. T/F
false
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65
According for Fick’s first law, the concentration of diffusing species is a function of both time and position. T/F
false
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66
D_interstitial << D_substitutional

T/F
false
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67
In edge dislocation, burger’s vector is perpendicular to dislocation line. T/F
true
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68
Diffusion coefficient _________ with increasing temperature
increases
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69
What are the interfacial defects?
twin boundaries, grain boundaries, stacking faults
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70
I can observe individual atoms using an optical microscope. T/F
false
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71
What’s an example to processing using diffusion
case hardening
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72
Interstitial diffusion is more rapid than vacancy diffusion. T/F
true
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73
Equiaxed grains are
Roughly the same dimension in all directions
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74
Columnar grains are
grains elongated in one direction
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75
Rate of diffusion is __________ of time
independent
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76
Diffusion is ____________ of time
dependent
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77
What are the 5 interfacial defects?
external surfaces, phase boundaries, optical boundaries, twin boundaries, stacking faults
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