EGN 3365 Exam 2

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77 Terms

1
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The given stress-strain graph represents?
The given stress-strain graph represents?
Elastic then plastic deformation
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What does the figure represent?
What does the figure represent?
Simple compression
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Which material has the highest toughness?
Which material has the highest toughness?
Material 2
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For an engineering strain of 1, calculate percentage elongation (ductility) of the specimen?
100
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A specimen of copper having a rectangular cross-section 15.2 mm X 19.1 mmĀ  is pulled in tension with 44,500 NĀ  force, producing only elastic deformation. Calculate the resulting strain. ( Elastic modulus of copper = 110 GPa)
A specimen of copper having a rectangular cross-section 15.2 mm X 19.1 mmĀ  is pulled in tension with 44,500 NĀ  force, producing only elastic deformation. Calculate the resulting strain. ( Elastic modulus of copper = 110 GPa)
1\.39 x 10^-3
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Ductility is the amount of plastic deformation at failure.

From the given graph below, determine which line represent a material with high ductility and which line represent a material with low ductility.
Ductility is the amount of plastic deformation at failure.

From the given graph below, determine which line represent a material with high ductility and which line represent a material with low ductility.
Blue line: Low ductility.

Green line: High ductility.
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For some metal alloy, the true stress of 345 MPa produces a plastic true strain of 0.02. How much does a specimen of this material elongate when true stress of 415 MPa is applied if the original length is 500 mm? Assume a value of 0.22 for the strain-hardening exponent, n.
For some metal alloy, the true stress of 345 MPa produces a plastic true strain of 0.02. How much does a specimen of this material elongate when true stress of 415 MPa is applied if the original length is 500 mm? Assume a value of 0.22 for the strain-hardening exponent, n.
23\.7mm
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Poisson's ratio for metals, ceramics and polymers is in the range:
0\.15 < v
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Deformation of a sample to an engineering strain of 2 means that the sample is ___________ its original length.

A. Half

B. Twice

C. Three times

D. 2% longer than
Three times
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What best describes the figure?

A. Not an example of diffusion

B. Left: before diffusion, right: after diffusion

C. Left: after diffusion, right: before diffusion

D. None of the above
What best describes the figure?

A. Not an example of diffusion

B. Left: before diffusion, right: after diffusion

C. Left: after diffusion, right: before diffusion

D. None of the above
Left: before diffusion; right: after diffusion
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What is diffusion
Mass transport by atomic motion
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Atoms tend to _____________ from regions of _____________ concentration to regions of _____________ concentration.
Migrate, high, low
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What is self-diffusion?
Migration of host atoms in pure metals
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What is the derivation of the equation relating the diffusion coefficients at two temperatures T1 and T2, given that:
What is the derivation of the equation relating the diffusion coefficients at two temperatures T1 and T2, given that:
Dā‚‚ = Dā‚exp \[-Qd/R(1/T2-1/T2)\]
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At 300Ā°C the diffusion coefficient and activation energy for Cu in Si are

Dā‚ (300Ā°C) = 7.8 Ɨ 10ā»ā»Ā¹Ā¹ mĀ²/s

Qd = 41.5 kJ/mol

Compute the diffusion coefficient Dā‚‚ at 400Ā°C.
28\.46 Ɨ 10ā»ā»Ā¹Ā¹ mĀ²/s
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Non-steady state diffusion is a function of:
Time and position
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Fickā€™s first law of diffusion is applicable to
Steady state diffusion
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Whatā€™s Fickā€™s second law of diffusion?
dC/dt = D dĀ²C/dxĀ²
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What's Fickā€™s first law of diffusion?
J = āˆ’D dC/dx
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Whatā€™s the relationship between the diffusion coefficient and temperature?
Increases with increasing temp
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What is interdiffusion?
Diffusion of atoms of one material into another material
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Diffusion rate of vacancy diffusion depends on
Number of vacancies, activation energy
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interstitial diffusion
smaller atoms diffuse between adjacent atoms, faster than vacancy diffusion
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Case hardening is an example of _________ diffusion
Interstitial
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case hardening
outer surface is hardened by diffusing carbon atoms into surface
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Doping
adding impurities to a semiconductor to increase conductivity
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Process of doping

1. P rich layers on surface
2. Heat it
3. Doped semiconductor regions
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Diffusion is faster for
open crystal structures, materials with secondary bonding, smaller diffusing atoms, lower density materials
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Tensile load (pulling)
If a specimen is being elongated or extended
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Compressive load (pushing)
Specimen is compressed or contracted
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Deformation
Change in dimension
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shear forces
Parallel to cross sectional area
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Plastic deformation
permanent change in shape by bending and folding
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Elastic deformation
material returns to original state when stress is removed
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Common states of stress
Simple tension, torsion, simple compression, bi-axial tension, hydrostatic compression
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Yield strength
point where the material begins to plastically deform
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Toughness
the ability of a material to resist fracture
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Hardness
resistance to localized surface deformation and compressive stresses
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Resilience
Ability of a material to store energy
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Ductility
amount of plastic deformation at failure
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Engineering stress
tensile, shear
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Engineering strain
tensile, lateral, shear
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Percent elongation
the total percent increase in length of a specimen during the tensile test
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Dislocation
A defect where atoms are misaligned around it
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Edge dislocation
extra half plane of atoms inserted into a crystal structure
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Dislocation line
The line where dislocations happen
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Screw dislocation
lattice plane shifts similar to a spiral staircase
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Burgers vector
measure of lattice distortion
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Twin boundary
a reflection of atom positions across the twin plane
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Solidification
Result of casting molten material
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Grain boundaries
Regions between grains (crystals)
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Point defects
vacancy, interstitial atoms, substitutional atoms
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Vacancies are
vacant atomic sites
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Dislocations move when
Stresses are applied
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A catalyst \____________ the rate is a chemical reaction without being consumed
Increases
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Dislocation types include
Edge, screw, and mixed
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two diffusion mechanisms
vacancy and interstitial
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The applied mechanical force is normalized to
Stress
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The degree of deformation is normalized to
strain
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Elastic deformation is
nonpermanent and reversible
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Plastic deformation is
permanent and nonrecoverable
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Stiffness
a material's resistance to elastic deformation
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Strength
A materials resistance to plastic deformation
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In an optical microscope, grain boundaries appear as white lines after the surface is prepared by etching. T/F
false
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According for Fickā€™s first law, the concentration of diffusing species is a function of both time and position. T/F
false
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D_interstitial << D_substitutional

T/F
false
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In edge dislocation, burgerā€™s vector is perpendicular to dislocation line. T/F
true
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Diffusion coefficient _________ with increasing temperature
increases
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What are the interfacial defects?
twin boundaries, grain boundaries, stacking faults
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I can observe individual atoms using an optical microscope. T/F
false
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Whatā€™s an example to processing using diffusion
case hardening
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Interstitial diffusion is more rapid than vacancy diffusion. T/F
true
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Equiaxed grains are
Roughly the same dimension in all directions
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Columnar grains are
grains elongated in one direction
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Rate of diffusion is __________ of time
independent
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Diffusion is ____________ of time
dependent
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What are the 5 interfacial defects?
external surfaces, phase boundaries, optical boundaries, twin boundaries, stacking faults