Materials (Weeks 1-6)

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39 Terms

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Ionic Bonding:

Electrostatic Force (Transferring Electrons)

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Covalent Bonding

Sharing Electrons

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Metallic Bonding

Packed in lattice Structure (Free electrons)

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Elastic Modulus

  • Material's stiffness or resistance to elastic (non-permanent) deformation

  • The steeper the line, the lower the Elastic modulus

  • The slope of the stress/strain curve

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Atomic Packing Factor

Volume of atoms in Unit Cell/

Volume of Unit Cell

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Theoretical Density

nA/VcNa

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n for BCC

2

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n for FCC

4

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n for HCP

6

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Bravais Lattice

14 possible geometric arrangements, including BCC, FCC and HCP

<p>14 possible geometric arrangements, including BCC, FCC and HCP</p>
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FCC Lattice Constant

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BCC Lattice Constant

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Lattice constant/Lattice parameter (a)

Physical dimension of a unit cell

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SEM (Scanning Electron Microscopy)

  • Uses focused beam of electrons to produce an image

  • 3D image capabilities

  • Topography, Morphology and Texture

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TEM (Transition Electron Microscopy)

  • Beam of electrons through ultra thin sample

  • Subcellular, Grain boundaries, material identfication

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Edge Dislocation

Extra Half Plane

<p>Extra Half Plane</p>
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Screw Dislocation

Spiral Planar ramp resulting from shear deformation

<p><span>Spiral Planar ramp resulting from shear deformation</span></p><p></p>
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Interstitial diffusion

small atoms, migrate through the spaces (interstitial sites) between larger host atoms in a crystal lattice. the most efficent

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Vacancy diffusion

when atoms, of similar size to the host lattice, exchange positions with neighboring vacancies (empty lattice sites), requiring the vacancy to move through the crystal

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Stress-Strain curve

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Load Displacement Curve

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Tensile and compressive Stress

=Force/Area Before Loading

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Tensile Strain

Change in length/New length

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Sheer stress

Sheer force/Original Area

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Compressive strain

Same as tensile but with negative delta

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Lateral Strain

Change in length/original width

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Possions Ration (v)

Lateral strain/Londituninal strain

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Stress Strain Plot

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Tensile Strength (TS)

Max point on the stress strain curve

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Yield Strength

Stress at which noticeable deformation occurs

  • 0.2 offset from x intercept

  • Highest pressure at end of elastic modulus

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Ductility (EL)

Largest strain before failure

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True stress and strain

Always greater than engineering stress

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Stress vs Strain

Stress is the internal forces at play, where as strain measured the deformation of the material

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Number of Vacanies

Fraction of vacancies x Number of Sites

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Number of Sites

Density/Atomic weight x Avodgrados number

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Fraction of Vacancies

exp(-Activation Energy/Boltzmans constant x temperature)

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