Electronics Manufacturing

This flashcard set covers key concepts and vocabulary from the lecture on Electronics Manufacturing.

Electronics Manufacturing

The process of designing and producing electronic devices and components.

Interconnection requirements

The necessary connections for signal lines, electrical power, and heat removal in electronic systems.

PCB (Printed Circuit Board) manufacturing

Processes including photolithography, drilling, and etching used to create PCBs.

Moore’s Law

The observation that the number of transistors on a chip will double approximately every two years.

Rent’s Rule

A principle stating that the number of inputs/outputs required will increase with the complexity of a circuit.

Die

A piece of silicon that contains the circuitry for an integrated circuit (IC).

Wire bonding

A method of making electrical connections to semiconductor chips using thin wires.

Flip Chip

An interconnection method that allows for direct attachment of the chip to the substrate with minimized packaging.

TAB bonding (Tape Automated Bonding)

A high-speed method of attaching chips to a flexible tape for efficient interconnection.

Under Bump Metallisation (UBM)

A layer applied to chip bond pads to create solder bumps prior to flip chip assembly.

Electrical performance

The effectiveness of an electronic device in transmitting signals and power.

Known Good Die

A method to identify and test good dies on a wafer before packaging.