Electronics Manufacturing

These flashcards cover key concepts and terminology from the lecture on Electronics Manufacturing, including PCB technologies, component types, and assembly methods.

Through Hole / Pin Through Hole (TH/PTH) Technology

Traditional PCB assembly technology that utilizes pins inserted through holes in the board.

Dual In Line (DIL)

A type of integrated circuit package with pins arranged in two parallel rows.

Surface Mount Technology (SMT)

An advanced form of PCB assembly that allows components to be mounted directly onto the surface of the board.

Area Array Packages

IC packages where contact pads are arranged in a grid, such as Ball Grid Array (BGA).

Rent's Rule

For microprocessors, increasing the number of transistors by 10 implies a doubling of the number of leads.

Passive Components

Components that do not require power to operate, such as resistors, capacitors, and inductors.

Active Components

Components that require power to operate, such as diodes, transistors, and integrated circuits.

Pick and Place Machine

A machine used to place components onto PCBs at high speeds, often exceeding 12,000 components per hour.

Local Fiducials

Marks used in vision systems on PCBs to accurately identify placement positions for components.

Electrode Leadless Face (MELF)

A type of passive component packaging without leads, typically for resistors and diodes.