Electronics Manufacturing

These flashcards cover essential vocabulary related to electronics manufacturing and soldering processes, assisting in exam preparation.

Soldering

A process of joining two materials using a molten filler with a lower melting point.

Welding

A process where the parent materials are melted together.

Brazing

Joining materials using a filler that melts at temperatures above 400ºC.

Solder Alloy

A mixture of metals used for soldering, often with a lower melting point.

Intermetallics

Compounds formed between two metals during the soldering process.

Wetting

The ability of liquid solder to spread and adhere to a surface.

Flux

A chemical cleaning agent that helps solder adhere to surfaces.

Rosin Flux

A traditional flux made from pine tree extracts to clean metal surfaces before soldering.

Surface Tension

The property of a liquid that allows it to resist external force due to cohesive nature.

De-wetting

A situation where solder withdraws from a surface it initially wetted.

Solder Paste

A mixture of solder particles, flux, and solvents, used in reflow soldering.

Eutectic Alloy

An alloy with a specific composition that has a single, lower melting point.

SnPb37

A tin-lead eutectic alloy with a melting point of 183ºC.

RoHS Directive

Regulation that restricts the use of certain hazardous substances in electrical and electronic equipment.

Surface Energy

The energy per unit area at the interface of two phases that influences wetting.

Thermal Shock

A rapid temperature change that can lead to material failure.

Reflow Soldering

A process where solder paste is heated to melt solder particles and join components.

Mass Soldering

A soldering technique where molten solder is applied directly to the product.

Wave Soldering

A mass soldering process where PCBs are moved over a wave of molten solder.

Dip Soldering

A process of immersing components into molten solder for joining.

Component Leg

The part of an electronic component that connects it to a PCB.

Inspection

The process of examining solder joints to ensure quality and reliability.

Oxide Film

A layer of oxide that forms on metal surfaces and can hinder soldering.

Preheat

Initial heating phase in reflow soldering to prepare surfaces for soldering.

Cooling

Final phase in soldering where solder solidifies after joining components.

Heat Transfer

The movement of heat necessary for processes like soldering.

Flux Activity

The performance of flux to clean surfaces and facilitate soldering.

Lead-Free Solder

Solder that does not contain lead, often made of tin and other metals.

Thermal Soak

A period during which the assembly reaches a uniform temperature before reflow.

Solder Balling

The formation of solder drops on surfaces during the soldering process.

Pot of Molten Solder

A container holding molten solder used in mass soldering techniques.

Safety Practices

Procedures to minimize hazards related to soldering operations.

Component Placement

The method of positioning components on a PCB prior to soldering.

Soldering Iron

A hand tool used to heat solder and join electronic components.

Cored Solder Wire

A solder wire filled with flux for easier soldering.

Solder Joint

The bond formed between two materials during soldering.

Hot Air Soldering

Soldering technique that uses heated air to melt solder.

Adhesion

The ability of the solder to stick to the surfaces being joined.

Thermodynamics

The branch of physics that deals with heat and temperature and their relation to energy.

Clean Surface

A surface free from contaminants to allow proper soldering.