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Vocabulary flashcards covering key concepts from the lecture notes on thermal expansion of solids.
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Thermal expansion
The tendency of matter to increase in size when the temperature increases.
Thermal contraction
The tendency of matter to decrease in size as the temperature decreases.
Linear thermal expansion
The increase in a solid’s length due to a rise in temperature, described by ΔL = α ΔT L0 for small ΔT.
Change in length (ΔL)
The difference between a final length and the original length: ΔL = L − L0.
Change in temperature (ΔT)
The difference between the final and initial temperatures: ΔT = T − T0.
Original length (L0)
The length of an object at the reference temperature T0.
Coefficient of linear expansion (α)
A material-specific constant relating ΔL to ΔT; has units of 1/°C (or K−1).
Volume expansion
The change in an object's volume due to a temperature change; described by the volume expansion equation for solids and liquids (gases use the ideal gas law).
Gases and ideal gas law
For gases, thermal expansion is typically described by the ideal gas law rather than solid/liquid expansion equations.
Expansion joint
An assembly designed to absorb expansion and contraction in structures to prevent damage.
Buckling
Deformation or instability in a structural component due to thermal expansion if not accommodated.
Thermal stress
Stress that develops when a restrained object changes temperature, potentially causing cracks or deformation.
Piston and cylinder expansion
In engines, the thermal expansion of pistons and cylinders must be accounted for to maintain performance and avoid failure.
Bearings and shafts expansion considerations
Choice of bearings/shafts must account for thermal expansion to prevent binding or failure.
Rail gaps
Gaps between rails to accommodate expansion and prevent buckling.
Wood joinery
Traditional carpentry methods that accommodate movement due to wood expansion/contraction without damage.
Steel tower expansion example
Example: steel tower height changes with temperature; ΔL = α ΔT L0, with steel α ≈ 1.2×10−5 K−1.
α units
The coefficient of linear expansion α has units of 1/°C (or K−1) and is scale-independent (°C or K give the same numerical value).
Holes and thermal expansion
Holes in an object expand along with the object during thermal expansion.
PCB expansion effects
Thermal expansion of components in printed circuit boards can affect electrical integrity and cause warping if not managed.