Basic Soldering in Avionics Training

Flashcards created to help students prepare for the examination in Basic Soldering techniques.

Soldering

The process of joining two metals together using a solder alloy.

Flux

A substance used to remove oxidation from metal surfaces to ensure proper soldering.

Wicking Method

A technique that uses braided copper wire or stranded wire saturated with flux to remove solder by capillary action.

Solder Sucker

A tool that uses a vacuum to remove molten solder from a joint.

Heat & Pull Method

A technique where solder joints are melted with heat and leads are pulled to remove them.

DIP (Dual Inline Pack)

A type of IC packaging with two rows of formed flat leads for mounting on a PCB.

Thermal Linkage

The area of contact for heat transfer between the soldering iron tip and the workpiece.

Fillet

The curved surface created by solder around a lead or connection.

Concave Solder Joint

A solder joint where the solder is slightly recessed to form a smooth internal surface.

Proper Insulation Gap

The specified distance between wire insulation and the entry point into a terminal.