Semiconductor Process

Silicon

Main Material of Semiconductor.

Wafer

Foundation for the Semiconductor

Photolithography

Light is used to transfer patterns into the wafer.

Deposition

Coating the thin film at a desired molecular or atomic level onto the wafer.

Ion Implementation

Giving semiconductor electrical characteristics.

Electrical Die Sort

Wafer level testing step used to identify defective ships before packaging.

Wafer Sawing / Dicing

The completed wafer is cut into individual semiconductor chips called dies.

Chips Bonding

The diced chips are carefully mounted onto the PCB.

Wire Bonding

In this step, the tiny contact points on the chip are connected to the corresponding contact points on the PCB

Molding Process

The chip is encased in a protective material.

Sealing and Labelling / Marking

The chip is sealed and labeled with the product name or code.

Final Testing

The packaged chip undergoes a final test to ensure it works properly.

Semiconductor Packaging

The process of transforming wafers containing multiple chips into individual, protected devices ready for use.

4-5 inch Wafers

Wafer diameter. Used for discrete devices. Diodes, transistors. Can hold thousands of devices per wafer.

6 inch Wafers

Wafer diameter. Used for power transistors.

8 Inch Wafers

Wafer Diameter. Used for high pin count ICs. Optimized for production cost.

12 Inch Wafers

Wafer Diameter. Advanced High Pin ICs. Most expensive.

Wafer Mounting

The process of securing the wafer onto a tape attached to a metal ring.

Die Attach

The diced chips are carefully mounted onto lead frame.

Lead Frames

Made of copper allow. Excellent conductor. Designed in Matrix form. Suitable for discrete and IC devices. Low-High Pin Count.

Laminate Substrate

Commonly used in BGA Packages. Provides high density interconnections. More expensive than lead frames.

Wafer Handler

Holds and positions the wafer for die picking.

Ejector Assembly

Pushes the die up so the pick and place arm can pick it.

Bond Arm / Pick and Place

Transfers the die to the lead frame.

Curing Step

Materials are cured in an oven to harden the adhesive epoxy.

Gold Wire

Most popular for ball bonding. Good for aluminum bond pads. Very expensive.

Copper Wire

Better conductor than gold. Cheaper. Harder to bond and oxidizes.

Aluminum Wire

Used for wedge bonding. Low cost and can be made in larger diameter.

Silver Wire

Lower cost than gold. Good conductor. Softer than cooper. Less prone to oxidation.

Transfer Molding Process

Epoxy Molded Compound is placed in the transfer pot and melting,