defects

.

Ink Residue

.

Ink Lose

.

Wafer Broken

.

Die Chip/Crack

.

Surface Scratch

.

Kerf Mis-placement

.

Wafer Foreign Matter

.

Wafer Broken

.

Silicon Dust

.

Peeling

.

Incomplete Cut

.

Contamination/Discoloration on Pads

.

Oxidation/Corrosion on Pad

.

Contamination/Discoloration on Edge

.

Probe mark defect

Probe Mark Not More than 3 times(reject over 3 times)(Reject probe mark exceed 25% Metallization) ( Reject Probe mark exceeded to metal)

.

Passivation Mis-alignment/Opening Defect

If Passivation Covers more than 25% of bond pad area, it will be rejected

.

Tape Fall Off

.

Dice Fly off

.

Cutting Performance of Laser Grooving

 Need to check any abnormal of blade kerf shift for LG device and can not touch grooving edge)

.

Surface Scratch

.

Surface Damaged

.

Seepage on Wafer

.

Missing Bump

.

OR Irregular Bump

(reject ball dia. bigger or smaller than 25% of ball size

.

Bump Bridge

.

Damaged Bump

Reject Ball Damage < 15% ball height)

.

Wafer Ball Discoloration

.

BackSide Chipping

backside chipping <= to 80um

.

Side Chipping

(Wafer thickness > 4.7 mil, side chipping <= 60 um) (wafer thickness<= 4.7 mil,side chipping <= 1/2 wafer thickness)

.

Sidewall Chipping / Crack

.

Top Sidewall Chipping / Crack

.

Discoloration (Delamination)

.

Blade Damage