TERMINATION

Termination

A process where green are dip into pase to form the external electrode

Loading → Pressing → 1st Dipping → 1st Drying → Transfer → 2nd Dipping → 2nd Drying → Eject

Process Flow of Termination

Dipping

A process where paste is execessively applied to form a circulat shape

Blotting

A process of controlling the uniformity the shape and thickness

Palomar (PSNT)
Tapeline (R2R
SMT
Chip Start
Plasma Machine

5 machine in termination

Palomar Machine

A machine that is used to terminate 1608 ~ 3225 sizes of MLCC, where the medium is dip in copper paste to form a carrier plate

Tapeline

A machine that is used to terminate 0603 ~ 1005 sizes of chip; it use the concept of palomar machione

SMT Machine

A machine that used to form/terminate 1005 ~ 3216 chip sizes

Plasma Machine

A machine that use mooning effect; wherein it is used to improve by applying hydrophobic plasma that apply to process

Bandwidth
Mooning Effect
Length

What are the three (3) parameter use to control in termination process

Bandwidth (BW)

A copper length in the surface of the chip (Dipping length)

Mooning Effect

Measurement of length of the round part (Dipping Delay Time)

Copper Paste
Epoxy Paste

What are the 2 termination paste

Copper Paste

What type of paste is used for 1st and 2nd dipping of termination

Epoxy Paste

What type of paste is used for 2nd Coating

Raw Material
Pre-Dispersion
Paste Dispersion
Viscosity Dispersion

4 Process of Paste making

Copper Metal
Glass Frits
binder resin

3 Copper Paste Composition

Copper Metal

A ductile material metal with high therm and electrical conductivity

Glass Frits

A amporphous material (non crystallize)

Binder resin

A composition to bind copper and glass frits; acrylic binder that is usually use for firing type process