MEMS - Lithography I, II

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Last updated 1:04 PM on 4/30/26
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5 Terms

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Photolithography in semiconductor fab

photolith used to define patterns at every stage

<p>photolith used to define patterns at every stage</p>
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General steps

  1. Vapour prime - adhedes resist to substrate

  2. Spin-coat resist - pour on resist, spin for uniform layer

  3. soft bake- drives off solvent/improves adhesion

  4. expose- mask pattern transferred via UV light to latent image in resist

  5. post-exposure bake- optional for most resists

  6. develop- converts latent image to topographic pattern in resist

  7. hard bake- improves chemical and physical robustness of patterned resist layer

  8. inspect- for malformities


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positive resist

exposure increases solubility, additive

<p>exposure increases solubility, additive</p>
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negative resist

exposure decreases solubility in developer

<p>exposure decreases solubility in developer</p>
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skipping sections on dip pen nanolith, non-imprint lith, scanning probe tehcniques, electron beam lithorgraphy, LIGA

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