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which of the following in NOT a mechanical property?
Thermal conductivity
an amorphous crystal structure has short range order only
true
metals are made up of mostly
metallic elements
the same material that is processed differently will have the same properties
false
metals are usually
crystalline
metals usually are
multi grain
glasses usually are
amorphous
glasses usually are
Neither A nor B are applicable for glass
ceramic usually are
crystalline or a mix of amorphous and crystalline regions
ceramic are usually
multi grain
thermoplastics usually are
amorphous or a mix of amorphous and crystalline regions
thermosets usually are
amorphous
palmers are made up of mostly
nonmetallic elements
ceramic are made up of mostly
a mix if metallic and nonmetallic elements
semiconductors are usually
crystalline
semiconductors are usually
single grain
which material type usually has the highest density
metals
which material type is the least prone to corrosion
ceramics
which material type typically has both high strength and ductility
metals
which material type is the most limited in the temperature that it can operate (high temp.)?
polymers
which material type usually has the lowest density
polymers
which material type usually has the highest stiffness
ceramics
which material type usually has the lowest stiffness
polymers
which material type typically has the highest thermal conductivity
metals
which material type typically has the highest electrical conductivity
metals
which material type typically can be operated at the highest temperature
ceramics
which form of SiO2 is transparent
amorphous SiO2
which form of carbon is the hardest
diamond
which polymer type is the easiest to recycle
thermoplastics
which polymer type is the most brittle
thermoset
which type of polymer can deform the most without breaking
elastomers
the most common semiconductor is
silicon
at the same temperature, the spacing between atoms in AL2O3 is the same in the US as it is in Australia
true
the equilibrium spacing between atoms in a solid is the same at all temperatures
false
it takes a force to move atoms in solids away from their equilibrium positions
true
primary bonds are stronger than secondary bonds
true
the primary bonding type that involves the transfer of electrons to form positive and negative ions is
ionic bonding
the primary bonding type that involves sharing of electrons that are not free to move is
covalent bonding
the type of bonding that occurs where valence electrons flow freely is
metallic bonding
the type of bonding that occurs mostly in metals is
metallic bonding
the type of bonding that occurs mostly in ceramics is
covalent, ionic or a mix of the two
the type of bonding that occurs mostly in semiconductors is
covalent bonding
the type of bonding that occurs mostly in thermoplastic is
covalent + secondary bonding
the strength of an elastomer can be increased by
increasing the number of covalent bonds
covalent bonds are not directional
fasle
the bonding energy for MgO is 1000 kj/mole. the bonding energy for tungsten is 849 kj/mole. which of the two would you predict would have a higher melting point?
MgO
the bonding energy fir MgO is 1000 kj/mole. the bonding energy for tungsten is 849 kj/mole. which of the two would you predict would have a higher stiffness?
MgO
the same compound can form a crystalline or an amorphous structure
true
atoms in solids are not at their equilibrium position near defects
true
the number of vacancies in a solid decreases as temperature increases
false
a substitutional solid solution is more likely to occur when the minor element atom (solute) is small relative to the major element atom (solvent)
false
an interstitial solid solution is more likely to occur when the minor element atom is small relative to the major element atom
true
defects affect the properties of materials
true
permanent deformation to a material when loaded is called
plastic deformation
if plastic deformation is difficult, ductility is lower
true
the metal crystal structure with the highest ductility is
face centered cubic
the metal crystal structure with the lowest ductility is
hexagonal close pack
dislocation slip is easiest in which metallic crystal structure
face centered cubic
dislocation slip is easier in ceramics
false
which of the following is stronger
copper with 10 wt% zinc
which of the following is stronger
plastically deformed copper
which of the following is stronger
a single phase aluminum alloy
which of the following is stronger
pure copper with a small grain size
the number of vacancies increases with increasing temperature
true
dislocation slip occurs along random directions in crystal
false
plastic deformation occurs by bonds breaking and reforming
true
which of the following will be stronger
a thermoplastic rope that has been formed with plastic deformation.