PLATING PROCES

Plating Process

A process of depositing the metal on surface on another material

Plating Process

A process where purpose is to have electrical conductivity, surface mounting and bonding wear resistance

Electroplating

A long life solution; where chip is force plating by using the external electical power

Electroless Plating

Short Life Span; subsitution & reduction mechanism

Plating Solution
Rectifier
Electrode
Bath

Main elements of electroplating

Plating Solution

Contains metal ion where w/c will be deposited to substrate

Rectifier

A process of AC to DC, helps for uniform thickness

Anode (Oxidation) and Cathode (reduction)

2 types of electrode

bath

A process of electroplating for circulation, cigitation, and filtration and temp control

Faradays Fir law of Electrolysis

What principle does electroplating use

Faradays first law of electrolysis

the amount of a substance produced at an electrode is directly proportional to the total electric charge passed through the electrolyte

Where: current and thickess will increase

Faradays 2nd law of electrolysis

when the same electric charge passes through different electrolytes, the masses of substances deposited are proportional to their equivalent weights

Ni Plating

A material that has good heat resistant, prevent soiderability and decrease possible defect
Sn

Sn

Good solderability and maintain good adhesion