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Location of Fermi energy in semiconductors
Halfway between conduction and valence bands, E_g/2
Intrinsic semiconductor conductivity
sigma = N_e*e*mu_e + N_h*e*mu_h
increasing temperature = _______ conductivity
increasing
Why are direct bandgap semiconductors used in optoelectronic devices?
direct = vertical/radiative recombination, indirect = nonradiative recombination
Radiative recombination reaction
electron + hole = photon (light)
Nonradiative recombination reaction
electron + hole = phonon (heat)
n-doped semiconductors
semiconductors doped with donors, extra electrons weakly bound to dopant atoms, extra negative charge
p-doped semiconductors
semiconductors doped with acceptors, available electron states, extra positive charge

What are the regions in this graph? (left to right, include region as T→0)
intrinsic region, extrinsic region, dopant ionization, freeze-out range
Freeze-out range
close to T=0, electrons/holes are bound to the donor/acceptor atoms
Dopant ionization
extra electrons/holes are available for conduction, dissociate from dopants
Extrinsic region
donors/acceptors are completely ionized, carrier concentration is relatively constant
Intrinsic region
thermally excited carriers are dominant
Why is the binding/ionization energy in semiconductors lower than that of the hydrogen Bohr model?
semiconductors have a small effective mass and large permittivity, so the binding energy is much lower
p-n junction
the interface between p-type and n-type doped semiconductors
depletion region
the region around the interface of a p-n junction where an electric field is present, free carriers diffuse and recombine, creating a depletion of free carriers
contact potential (p-n)
the potential at the p-n interface due to the equilibrium of the Fermi energy level and the associated electric field in the depletion region
Schottky barrier
a potential barrier seen by electrons tunneling from the metal to the semiconductor, resulting in Schottky type contact with nonlinear I-V characteristics
drift current
current induced by the drift of thermally-generated (minority) carriers in response to an electric field
diffusion current
current induced by the diffusion of electrons and holes toward the interface in a p-n junction due to a concentration gradient
forward/reverse bias
when a p-n junction is connected to a battery, the applied potential works against/with the built-in voltage, suppresses/improves drift, and improves/suppresses carrier diffusion
reverse breakdown
a phenomenon that occurs at high reverse bias, resulting in a dramatic current increase and high loss of energy from atom ionization or Si-Si bond rupture
rectifying contact
a contact in which a Schottky junction is formed from the relative magnitudes of the metal/semiconductor work functions, resulting in nonlinear I-V characteristics (like a diode)
Ohmic contact
a contact in which an Ohmic junction is formed from the relative magnitudes of the metal/semiconductor, resulting in linear 1-V characteristics (like a standard resistor)
work function
the energy required to remove an electron from the Fermi energy level to the vacuum level
electron affinity
the energy required to free electrons at the bottom of the conduction band to the vacuum level
pinning
defect states at the semiconductor interface introduce available energy levels, so the Fermi level at the semiconductor surface does not change with the addition/removal of electrons
how solar cells work
p-n junctions with narrow/heavily-doped n-sides, light waves are absorbed in the depletion and p regions, a charge difference is created in the diode and generates a current
how LEDs work
p-n junctions with a direct bandgap, radiative recombination emits a photon
rectification
limiting the direction of current by controlling free carrier diffusion with a potential barrier
how transistors work
3 differently-doped regions work as 2 diodes, the provided voltage controls the output current by affecting how many holes diffuse through the transistor without recombination
how MOSFETs work
metal-oxide semiconductor field-effect transistor, applied voltage through gate repels holes and creates a depletion region, high voltage creates an n-channel for electron flow
Types of reverse breakdown
Avalanche (impact ionization), Zener tunneling (electron tunneling from the valence to conduction band)
Contact potential (metal/semiconductor)
the potential barrier seen by electrons tunneling from the semiconductor to the metal, resulting in Schottky type contact with nonlinear I-V characteristics