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Flat panel digital radiography (DR) eliminates having a ______, therefore reducing the steps for the radiographer
Cassette
DR systems use either a:
Direct detector with a photoconductor (one type)
Indirect detector with a scintillator (three types)
Direct detectors convert incoming x-ray photons to an ___________
Electronic digital signal
A direct detector uses ________ being the active layer (photoconductor) and a _________
Amorphous selenium (a-Se), thin film transistor (TFT)
_____ are used in flat panel technology for both amorphous silicon and selenium plates
TFT’s
TFT’s containing _________ are the last step of the x-ray conversion which collects the electric charge to produce an electronic readout
Detector elements (DELs)
TFT’s are set up like an array or matrix with pixel-size ______
DELs
_______ sense/collect and store image signal information and contain a switch
DELs
When DELs are filled with information, they become a ______
Dexel
Each pixel contains a “____________”, while other electronics which are not sensitive to charge
Sensing area
Fill factor
Refers to the sensing area compared to the non-sensing area (expressed as a percentage)
The fill factor has a _______ relationship with spatial resolution and contrast resolution
Direct
The ______ the fill factor, the ______ the spatial resolution and contrast resolution, compared to detectors with a lower fill factor
Higher
______ is a semiconductor with excellent x-ray photon detection ability
a-Se
The process of direct conversion contains three steps:
High voltage is applied to the top surface of a-Se
Ionization from the exposure frees the atoms from a-Se for the collection by electrodes at the bottom of an a-Se layer
Charges are collected by the TFT and are then read line by line to the computer for processing
Indirect detectors _______ directly convert x-rays into an electric signal
Cannot
Indirect detectors all use a ________
Scintillator
The three types of indirect detectors are:
Amorphous silicon (a-SI:H) with a flat panel TFT detector
Charged coupled device (CCD)
Complementary metal oxide semiconductor (CMOS)
All indirect detector systems need the ________ to change x-ray photons to light
Scintillator
All indirect detector systems must have a _______ or _______ to change light to an electronic signal
Photocathode or photodetector
The process of the indirect conversion when using amorphous silicon with a TFT contains three steps:
The scintillator emits light isotropically
Amorphous silicon (a-Si:H) acts as a light detector (photodiode)
Flat panel TFT detector read line by line to computer for processing
When the scintillator emits light isotropically is will be made of either two things:
Cesium iodide (Csl)
Rare-earth intensifying screen composed of gadolinium oxysulfide (Gd2O2S)
Amorphous silicon will need a relatively _____ layer to provide adequate sensitivity to photons and must be paired with a scintillator
Thicker
Amorphous silicon capture fluorescent light, and then converts that light into ____________ which are then gathered by the TFT within DELs
Electrical charges
The three disadvantages of using CMOS chips with the indirect conversion is:
Less stable over time
Yield lower quality images
More susceptible to noise
The DR images are processed with an algorithm selected that will use exposure field recognition, histogram analysis, and applying the ________
LUT
Flat field detectors can have bad ______, which creates artifacts
DELs
One major difference with DR processing (compared to CR) is that only exposed ______ are read and use for image data
DELs
DR panels range from $_____ to $_______
$30,000 to $80,000
The routine use of DR panels requires cleansing to prevent the spread of ________
Infection
Some DR panels can handle _____ lbs of direct weight, but only around 500 lbs if the DR panel is bending
800
Detector bag
Protects the DR panel from blood urine, discharge, scrub fluid, saline, etc