MEMS Final

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64 Terms

1

Scaling Laws

Address the structural and functional consequences of size changes among similar structures or organisms.

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2

MEMS Materials

Include silicon (single crystal, polycrystalline), metals (aluminum, copper, gold, titanium, platinum), and insulators (silicon dioxide, silicon nitride, titanium nitride).

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3

Intrinsic Conductivity

Increasing temperature leads to the production of free carriers in semiconductors through N-type and P-type doping.

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4

Transistors

Devices that switch and amplify signals, crucial in integrated circuits, including bipolar junction transistors and field-effect transistors.

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5

Moore’s Law

States that the number of transistors on a chip doubles approximately every two years.

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6

Microfabrication Processes

Involve property modification, patterning, subtractive processes like etching, and additive processes such as oxidation and deposition.

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7

Polymer MEMS

Utilize materials like elastomers (PDMS), thermoplastics (PMMA, PC, PS), hydrogels, and biodegradable polymers in microfabrication.

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8

Soft Lithography

A set of fabrication methods based on using a patterned elastomer layer like PDMS, including microcontact printing and replica molding.

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9

Glass MEMS

Utilize glass materials for applications like DNA microarrays and point-of-care diagnostics, involving photolithography and etching processes.

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10

Carbon MEMS

Involve the patterning and pyrolysis of photoresists to yield carbon films and 3D microstructures for applications like batteries and sensors.

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11

Micromixers

Mixing is crucial in microfluidics for homogenization of solutions in chemical reactions and biological processes like cell activation and protein folding.

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12

Passive

Micromixers with no moving parts relying on diffusion and geometry for mixing, including T and Y mixers, sequential mixing, and throttle design.

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13

Active

Micromixers enhancing fluid mixing by increasing interfacial area through piezoelectric devices, electrokinetic mixers, or chaotic convection.

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14

Serpentine Mixer

Micromixer design with two PDMS layers creating a helical flow pattern.

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15

Passive Chaotic Mixer

Micromixer utilizing microridges to induce turbulent flow at low Reynolds numbers.

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16

Sensor

Device converting physical parameters into electrical signals for detection, with applications in various fields.

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17

MEMS in Sensor Technology

Miniaturization, multiplicity, and integration of microelectronics for sensor control and operation.

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18

Sensor Classifications

Categorized into biological, chemical, mechanical, thermal, electrical, magnetic, and radiation sensors.

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19

Biosensor

Device combining biological elements with transducers to produce detectable electrical signals.

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20

Biological Element

Component in biosensors binding target molecules, requiring specificity, stability, and immobilization.

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21

Physiochemical Transducer

Part of biosensors transforming signals from bioelements into measurable electrical outputs, classified into various types.

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22

Enzyme-Based Biosensors

Biosensors utilizing enzymes for simple design and operation in detecting specific substrates.

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23

Antibody-Based Biosensors

Biosensors, also known as immunosensors, offering high specificity and sensitivity using antibodies for detection.

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24

Micromosaic Immunoassay

Microfluidic technique controlling antigen immobilization and antibody flow, producing fluorescence mosaic images.

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25

Cell-Based Biosensor

Biosensor detecting cellular parameters, pharmaceutical effects, and environmental toxicity.

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26

Immobilization of Biological Elements

Methods like physical absorption, entrapment, and covalent attachment connecting bioelements to transducers.

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27

Transducing Mechanism

Techniques like electrochemical, optical, mechanical sensing converting bioelement interactions into measurable signals.

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28

Optical Biosensors

Biosensors linking changes in light intensity to mass or concentration variations, utilizing fluorescent or colorimetric molecules.

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29

Genomics

Study of DNA mechanisms, protein synthesis, gene expression, and genetic material exchange, aided by techniques like PCR and DNA sequencing.

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30

RNA Types

Messenger, transfer, and ribosomal RNA involved in transcription and protein synthesis processes.

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31

Piezoelectric effect

Electric charge generated in response to mechanical stress

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32

Biosensing with piezoelectric materials

Utilizing materials like quartz crystals for biosensing applications

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33

Actuation using piezoelectric materials

Conversion of electrical energy into precise mechanical motion

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34

P-N junction function

Dissipating power and generating heat

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35

Polymer for injection molding

PMMA

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36

Three molding processes

Hot embossing, compression molding, injection molding

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37

Moore’s Law

States that the number of transistors in a dense integrated circuit doubles every two years

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38

Silicon as a semiconductor

Its conductivity can be tailored by doping

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39

Integrated circuit components

Active components include diodes, passive components include resistors

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40

Commonly used materials in BioMEMS devices

Silicon, glass, polymer

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41

Microfabrication processes for silicon-based MEMS

Deposition, patterning, etching

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42

Glasses for MEMS fabrication

Pyrex and quartz

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43

Glass micromachining process

Powder blasting

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44

MEMS

Microelectromechanical system

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45

IC

Integrated circuit

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46

PVD

Physical vapor deposition

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47

CVD

Chemical vapor deposition

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48

PDMS

Polydimethylsioxane

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49

PC

Polycarbonate

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50

Advantages of using MEMS device for ELISA

Faster and more sensitive detection, less reagent used

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51

Electrostatic force in smaller devices

Used due to l² relationship, less affected by scale changes

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52

Positive photoresist result

Unexposed resist remains

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53

Negative photoresist result

Exposed resist remains

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54

Process for creating a shallow rectangular trench in pyrex

Powder blasting

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55

applications of MEMS devices

drug delivery, DNA microarray, lab on a chip, neural probe

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56

<l² means __________ effect at smaller sizes

reduced

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57

>l² means _________ effect at smaller sizes

increased

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58

MEMS processes

lithography, etching, deposition, packaging

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59

small amount of Si replaced with group V element, extra electron for each atom replaced

N-type doping

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60

small amount of Si replaced with group III element, hole created for each atom replaced

P-type doping

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61
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62

dopant concentration is 5 to 6 orders of magnitude higher concentrations than intrinsic

extrinsic semiconductors

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63

when electrons and holes recombine, energy is released in the form of photons

eletroluminescence

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