2 - Packaging Process

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Last updated 4:40 AM on 5/17/26
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10 Terms

1
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Quad Flat No Leads Package

Very small square shaped or rectangular plastic package with no heads.

2
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Lead Frame Packages

Provide structural support and electrical connectivity.

3
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Die Attach

Chip attached to the die pad of package support strcuture.

4
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Eutectic Die Attach

These die attach met at one lower temperature than a mixture of same material.

5
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Epoxy Die Attach

AKA Adhesive die attach, epoxy mixture applied to substrate.

6
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Flip Chip Bonding

Introduced by IBM (1962), Area Array connection 10k, good electrical behavior, all connections are done simultaneously.

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1st Gen Substrate

Lead frames made of copper and kovar. Extremely low I/O < 100

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2nd Gen Substrate

Ceramic substrate using thick film technology.

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3rd Gen Substrate

Organic Substrates

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4th Gen Substrates

Glass and silicon substrates.