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analog
film-screen imaging is called ________ imaging because the physical image varied continuously and was proportional to the intensity of the x-ray beam striking it
analog signal
this is the continuous wave of electrical current (raw data) used to send data thru a circuit board or wire, it cannot be seen with your eyes; it is the temporary electrical signal from each detector showing the exposure values that will tell the pixels how brightly to glow in the image on the monitor
digital
both computed radiography (CR) & direct radiography (DR) are _______. DR image receptors use electronic detectors to convert x-ray energy into electrical (analog) signal. This raw data is then converted to binary language (a matrix of bits) for processing. The image on the monitor is made of a continuous physical pattern of light representing the data & is thus considered an analog
computed radiography
cassette based systems that used storage scintillation phosphors to temporarily store energy made by the exposure (latent image); data was extracted in a CR reader to get the manifest image to appear on a monitor
direct radiography (DR)
no extra processing step to see the image; replaced cassettes w/ imaging detector arrays that capture, read, & display on a monitor
indirect digital capture radiography
converts x-rays to visible light using a scintillator, then to electrical signals, which may reduce spatial resolution
direct digital radiography
converts x-rays directly into electrical charges, preserving higher spatial resolution by avoiding scintillation
scintillation
materials like cesium iodide or gadolinium oxysulfide convert x-ray energy into light first, then electrical signal
FPD-TFT
CCD
CMOS
3 types of indirect capture collection IRs
charge-coupled device
CCD
charge-coupled device (CCD)
a light-sensitive integrated circuit that collects light, converts it to electrical charge related to the exposure and stores it in a capacitor; also used in digital cameras
complementary metal-oxide semiconductor system
CMOS
complementary metal-oxide semiconductor system (CMOS)
converts light into electrical signal using photosensitive pixels, then to digital with on-chip circuitry (each has its own amplifier, photodiode, storage capacitor, & transistors)
flat plate detector w/ thin film transistor
FPD-TFT
flat plate detector w/ thin film transistor (FPD-TFT)
a TFT array consists of semiconductors on a glass substrate on which a thin layer pf photodetector (a-silicon) is painted to collect light (capture element) and convert it to electrical charge in the capacitor. The TFT transmits the analog signal to the ADC. This is what modern diagnostic systems use
fiber optics or lenses
light is transmitted via ________ or _______ to the CCD sensor underneath
CCD sensor converts the light to electrical charge & transfers the charge across the sensor in a sequential manner to the analog-to-digital convertor (ADC) to be digitized
CCD charge transfer & digitization
analog-to-digital convert
ADC
require a separate ADC
limited in size
slower to process
bulkier
potential geometric distortion & resolution loss
CCD system limitations
hygroscopic
cesium iodide (CsI) is _________: it absorbs water so it must be sealed well
crystaline silion (c-Si)
in CMOS, each sensor has its own photodetector, ____________ to convert the light to electrical signal, stores it in capacitors & digitize it (no separate ADC is needed)
efficiency & speed benefits: rapid image requisition & works well with AEC due to pixel-level processing
limitations in Size & Sensitivity: smaller size & lower light sensitivity limit CMOS detectors’ spatial resolution in large-field imaging compared to CCD
Clinical Usability & Applications: CMOS detectors are suited for smaller receptors & specialized imaging (dentistry & mammo)
about CMOS detectors
DELs/pixels collect light from the CsI & convert it to electrical signal
sent thru channels to be converted to digital signal, which requires a separate ADC
How CCDs work
each DEL/pixel amplifies the light from the crystalline Si
converts it to electrical charge & then to digital signal- no separate ADC (analog to digital converter) is required
how CMOS work
all of the pixels can be devoted to light capture
the output’s uniformity (a key factor in image quality) is high
very light sensitive, better fill factor, responds to low light intensitites
wide dynamic range
CCD advantages
unequal response due to tiling
CsI is hygroscopic (absorbs moisture)
expensive to manufacture
consumes a lot of power
CCD disadvantages
each pixel has a digital conversion to output digital bits (no ADC necessary)
less power consumption
less expensive to manufacture
work well with AEC
fast acquisition times
CMOS advantages
reduced area available for light capture
uniformity is lower
less light sensitivity & resolution
more noisy
CMOS disadvantages
flat panel detectors (FPD)
are IRs made up of a detector matrix coated with photoconductor (direct) or scintillator (indirect) on a glass substrate
detector elements (DELs)
the detector matrix contains a photodiode that absorbs electrons & stores electrical charges. _______ are different than pixels but function similarly as data captured is specific to position & exposure value in the IR or monitor
thin film transistors (TFTs)
are electronic switches located on each DEL that capture & store the charge, & then send charges to the computer in an orderly fashion
capture element
storage capacitor
TFT switch
each DEL has 3 components:
capture element
either a photoconductor/photodiode like a-Se (direct) or photodetector like a-Si (indirect)
storage capacitor
to store the electrical charges
TFT switch
release the electrical charges to the ADC
fill factor
the percent (%) of a DELs area that can detect x-ray exposure, so larger fill factors are preferred. The detection area of a DEL is made smaller by the capacitor & TFT
reduces
bc the capacitor & switch are fixed in size regardless of the size of the DEL, reducing the DEL size _______ the total fill factor %
better
when reducing DEL size, smaller DELs have less exposure detection areas but have _______ spatial resolution
CsI or GdOS; CsI
scintillators in indirect FPD-TFT systems are made up of __________; convert x-ray photons to light, _______ has less spread & is preferred
amorphous silicon (a-Si)
beneath the scintillator, in indirect FPD-TFT systems, __________ photodetectors are painted in a thin layer directly on the DELs to convert light into electrical charges stored in capacitors for image readout
thin film transistors (TFTs)
____________ are layered onto a glass substrate & act as switches to read stored charges row by row, to send to the ADC (indirect FPD-TFT system)
image quality
cost
size
** most common clinical radiography detectors
indirect FPD-TFT systems clinical & educational relevance
NO scintillator: no light spread so preserves the fine image details for highest spatial resolution
Direct conversion technology: Direct FPD-TFT systems convert x-rays directly to electrical charges using an amorphous selenium (a-Se) as a photoconductor for uniform detection of exposure over a large surface area
Top Bias Electrode Layer: forces the electrons created in the a-Se down to the TFTs where the charge is stored in capacitors
Charge Collection & Readout: an electric field guides electrical charges to capacitors, which are read out by TFT arrays for digitization and processing the same Indirect FPD-TFT receptors
Clinical Importance: Direct DR systems offer superior image quality critical for applications like mammo with minimal resolution loss
Direct FPD-TFT systems
spatial resolution
the sharpness & accuracy of the anatomic structural lines; is characteristic of a digital system & equal to ½ the Nyquist frequency
Nyquist frequency
the highest spatial resolution (# of lp/mm) that a digital detector can capture w/ out distortion; determined by DEL spacing of DR systems
modulation transfer function
MTF
modulation transfer function (MTF)
a system’s ability to display contrast of objects of varying size as a function of spatial resolution; this is most commonly used to express the ideas expression of digital detector image resolution
limiting spatial resolution
LSR
limiting spatial resolution (LSR)
detector’s ability to resolve small structures, depends on the contrast of the target, exposure & display conditions so not as accurate as MTF
pixel
picture element of the system (CR) & display monitors
pixel pitch
distance btw 1 pixel or DEL & the center pf adjacent pixel (measured in microns)
DEL
detector elements in IR; one TFT = 1 pixel
matrix
rows & columns (grid) of pixels in a digital image area; this is fixed in the devices we are using (IR, monitor, etc.)
voxel
CT volume element, determined by the size of pixel & thickness of slice
FOV (field of view)
in CR the entire IP was read but in DR, only the exposed DELs are part of the image produced; collimated image
the smaller the focal spot → the sharper the image
minimize OID & maximize SID
changes in distance require adjustment in mAs
accurate positioning of the part & proper alignment of the part with AEC (if used) also remains critical
pay attention to the EI values as an indicator of proper exposure
review factors that may result in a histogram analysis error/collimation/positioning
evaluate proper positioning and tube-part-receptor alignment
Spatial Resolution: Geometric Factors