Solidification is the result of casting molten material and involves two steps:
Nuclei form.
Nuclei grow to form crystals, resulting in a grain structure.
The process starts with a molten material that is entirely liquid.
Crystals grow until they meet each other, forming the grain structure.
Grain boundaries are regions between crystals.
They represent the transition from the lattice of one region to that of another.
Grain boundaries are slightly disordered.
They have low density, resulting in:
High mobility
High diffusivity
High chemical reactivity
Polycrystalline material contains many grain boundaries.
No crystal is perfect; imperfections always exist.
Imperfections are important because many material properties are due to their presence.
Point Defects
Vacancy atoms
Interstitial atoms
Substitutional atoms
Line Defects
Dislocations
Area Defects
Grain Boundaries
The simplest point defect is a vacancy, which is a missing atom at a lattice site.
Vacancies increase the randomness (entropy) of the crystal, leading to a lack of order.
The equilibrium number of vacancies Nv for a given material depends on temperature and can be calculated using the following equation: Nv = N \exp \left( -\frac{Q_v}{kT} \right)
Where:
N = total number of atomic sites
T = Temperature in Kelvins
k = Boltzmann’s constant (1.38 × 10^{-23} J/atom-K or 8.62 × 10^{-5} eV/atom-K)
Q_v = Energy required for vacancy formation
Absolute temperature in Kelvins (K) is given by \degree C + 273.
Boltzmann’s constant per mole of atoms becomes the gas constant R = 8.31 J/mol-K.
For most metals, the fraction of vacancies \frac{N_v}{N} just below the melting temperature is approximately 10^{-4}, meaning one lattice site out of 10,000 will be empty.
A self-interstitial is an atom from the crystal that occupies a small void space (interstitial site) that is normally unoccupied.
Self-interstitials introduce relatively large distortions in the surrounding lattice.
Example: Calculate the equilibrium number of vacancies per cubic meter for copper at 1000°C.
Given:
Energy for vacancy formation, Q_v = 0.9 eV/atom
Atomic weight of copper, A_{Cu} = 63.5 g/mol
Density of copper at 1000°C, \rho = 8.4 g/cm^3
First, find the total number of atomic sites N using the equation: N = NA \frac{\rho}{A{Cu}}
Where: N_A = 6.023 \times 10^{23} atoms/mol
N = \frac{(6.023 \times 10^{23} atoms/mol) \times (8.4 g/cm^3)}{63.5 g/mol} = 8.0 \times 10^{28} atoms/m^3
Convert 1000°C to Kelvin:
T = 1000 \degree C + 273 = 1273 K
The number of vacancies at 1000°C is:
Nv = N \exp \left( -\frac{Qv}{kT} \right)
N_v = (8.0 \times 10^{28} atoms/m^3) \exp \left( -\frac{0.9 eV}{(8.62 \times 10^{-5} eV/K) \times (1273 K)} \right) = 2.2 \times 10^{25} vacancies/m^3
It is impossible to have a metal with only one type of atom.
Foreign atoms (impurities) will always be present and exist as crystalline point defects.
Even at 99.999% purity, there are approximately 10^{22} to 10^{23} impurity atoms per cubic meter of material.
This is why alloys are created by intentionally adding impurity atoms to impart specific characteristics to the material.
Adding impurity atoms to metals results in solid solutions and/or a new second phase.
Solute and solvent are terms used to describe a solution.
Solvent: The element or compound in a large quantity.
Solute: The element or compound in a minor concentration.
In a solid solution, the crystal structure is maintained, and no new structures are formed.
Impurity point defects in solid solutions are of two types:
Substitutional solution
Interstitial solution
Substitutional solution: Impurity atoms replace or substitute host atoms.
Interstitial solution: Impurity atoms fill the voids or interstices among host atoms.
The degree to which a solvent dissolves a solute depends on the following factors:
Atomic Size Factor: The difference in atomic radii of the two atoms must be less than \pm 15\%.
Crystal Structure: Both atom types must have the same crystal structure.
Electronegativity: If one atom is more electronegative and the other more electropositive, they may form an intermetallic compound instead of a substitutional solid solution.
Valences: One atom is more likely to dissolve in another when it has a higher valence.
Copper and nickel form a substitutional solid solution.
Atomic radii: Copper (0.128 nm), Nickel (0.125 nm)
Crystal structure: Both have FCC crystal structure
Electronegativity: Copper (1.9), Nickel (1.8)
Valences: Copper (+1), Nickel (+2)
Virtually all crystalline materials contain dislocations.
Dislocations can be introduced during:
Solidification
Plastic deformation
Thermal stresses due to rapid cooling
Dislocations can be found in metals, ceramics, and polymers.
Dislocations can be observed in crystalline materials using electron microscopes.
Mainly by transmission electron microscopy (TEM) with image formed by:
'Misfit' dislocations at interface
Dark-field (Ni3Al) either diffraction contrast (conventional TEM) or phase contrast (HREM - atomic resolution)
A dislocation is a linear or one-dimensional defect around which some of the atoms are misaligned.
Dislocations can be classified as:
Edge dislocation
Screw dislocation
Mixed dislocation
Edge dislocation: A linear defect that centers around a line defined along the end of the extra half-plane of atoms.
When a shear stress is applied to a dislocation, atoms are displaced, causing the dislocation to move one Burgers vector in the slip direction.
Continued movement of the dislocation creates a step, and the crystal is deformed.
The motion of a caterpillar (or a fold in a rug) is analogous to the motion of a dislocation.
The slip direction is always in the direction of the Burgers vector of the dislocation.
Screw dislocation is a linear defect formed by shear stress that produces distortion.
One region of the crystal is shifted one atomic distance relative to the other.
Most dislocations found in crystalline materials are neither pure edge nor pure screw dislocations.
A combination of the three dislocations exists simultaneously and are called mixed dislocations.
Burgers vector expresses the magnitude and direction of the lattice distortion.
The nature of a dislocation is defined by the relative orientations of the dislocation line and Burgers vector:
Edge dislocation: Perpendicular
Screw dislocation: Parallel
Mixed dislocation: Neither perpendicular nor parallel
Interfacial defects are boundaries that have two dimensions and normally separate regions of materials that have different crystal structures and/or crystallographic orientations.
Interfacial defects can fall into the following categories:
External surfaces
Grain boundaries
Twin boundaries
Stacking faults
Phase boundaries
Surface atoms of a crystal that are not bonded to the maximum number of nearest neighbors are not satisfied and give rise to surface energy (J/m² or erg/cm²).
To reduce this energy, materials tend to minimize the total surface energy if possible.
A grain boundary is a boundary separating two small grains or crystals having different crystallographic orientations in polycrystalline materials.
Various degrees of crystallographic misalignment between adjacent grains are possible.
A twin boundary is a special type of grain boundary across which there is a specific mirror lattice symmetry.
Atoms on one side of the boundary are located in mirror-image positions of the atoms on the other side.
The region of material between these boundaries is termed a twin.