Ionic Bond: Electrons are transferred between atoms, leading to a strong attraction between resulting charged ions.
Anion: Negatively charged atom with excess electrons.
Cation: Positively charged atom with fewer electrons.
Covalent Bond: Electrons are shared between atoms, forming molecules.
Metallic Bond: Electrons are shared among metal atoms creating a cloud of free-moving electrons.
Body-centered cubic (bcc): Crystal structure with atoms located at the corners and a single atom at the center.
Face-centered cubic (fcc): Crystal structure with atoms located at the corners and at the center of each face.
Hexagonal close-packed (hcp): Crystal structure with atoms arranged in a hexagonal configuration.
Primary Bonds: Strong atomic attractions that involve interactions of electrons.
Unit Cell: The basic repeating unit in crystal structures.
Electrostatic Attraction: Force between oppositely charged ions in ionic bonds.
Electron Cloud: Collective shared electrons that create attractive forces within metals.
Stability of Atoms: Atoms with eight outer electrons are more chemically stable.
Single Bond: One pair of electrons shared between two atoms.
Double Bond: Two pairs of electrons shared between two atoms.
Crystal Structure Density: The arrangement of atoms significantly influences material density.
Volume Assumption: The assumption for equal volumes for bcc and fcc unit cells.
BCC Unit Cell: Contains 2 atoms (1 at the center and 8 at the corners).
FCC Unit Cell: Contains 4 atoms (6 faces and 8 corners).
Elastic Deformation: Temporary shape change that reverts back when the applied force is removed.
Ductile Metals: Metals that have five or more slip systems enabling them to deform plastically.
Point Defects: Examples include missing atoms, extra atoms, or foreign atoms within a crystal structure.
Vacancy: A missing atom in the crystal lattice.
Interstitial Atom: An extra atom inserted within the lattice structure.
Impurity: A foreign atom that replaces a pure metal atom within the structure.
Dislocations: Linear defects that cause distortion in the crystal structure.
Edge Dislocation: A dislocation characterized by an extra half-plane of atoms.
Screw Dislocation: A dislocation forming a spiral arrangement of atoms.
Grain Boundaries: Surfaces that separate individual grains of a metal.
Anisotropic Behavior: Properties that vary with direction in single crystals.
Isotropic Behavior: Properties that do not vary with direction in polycrystals.
Grain Boundary Embrittlement: Weakening of material due to the infiltration of foreign atoms at the grain boundaries.
Recrystallization: The process of forming new grains to replace deformed ones,
Annealing: Heating a metal to restore its original properties while facilitating recovery and grain growth.
Tensile Test: Measures the load and displacement of materials to determine their ability to withstand tension.
Load: The force applied during a tensile test.
Displacement: The change in length that occurs during the test.
Stress: Defined as force per unit area acting on materials.
Strain: The relative deformation in relation to the original length.
Toughness: Measure of the energy absorbed by a material before fracture.
Modulus of Resilience: Amount of energy per unit volume up to the yield point a material can absorb.
Bauschinger Effect: The tendency of a material to exhibit lower yield strength in compression after experiencing tension.
True Stress: Evaluated as force divided by actual cross-sectional area during material deformation.
Creep: Permanent deformation that occurs under constant load over time, influenced by the material's melting temperature.
Creep Rate: The rate at which deformation increases with temperature.
Stainless Steels: Notable for their creep resistance.
Superalloys: High-performance materials used in extreme conditions, also resistant to creep.
Strength Factors: Actual material strength is often lower than theoretical estimates due to existing defects.
Fatigue: Weakening effect from repeated loading, characterized by an endurance limit below which failure will not occur.