Electronic Devices Lectures

The ideal component:

  • Take no space – to the nano meter

  • Weigh nothing – 0.1 lb

  • Use no power – small in size so small in power (micro or nano amps)

  • Costs nothing – $2 divided by 5x10-9 

  • Require no maintenance - 

  • Require no training to operate.

  • Last forever

SWPCMT and F

“Smart weightless power costs more training but lasts forever.”

Study the manual for buying semiconductors.


Semiconductor fundamentals:


Crystals

Some background

  • Bell Laboratories (1947) - the 1st transistor was made

    • John Bardeen

    • Walter Brattain

    • William Shockley

  • 2012 – 20nm 128Gb NAND chip with 4.5x1012 transistors

  • The first integrated circuit

    • Robert Noyce

    • The mayor of Silicon Valley

    • Fairchild (1957)

    • Intel (1968)

    • Jack Kilby

      • Texas instruments

      • Nobel prize

    • First IC at Fairchild semiconductor (1958)

    • First IC at Texas Instruments (1958)

Silicon Valley history

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Left graph - # of transistor in a chip

Right graph – Size of chip

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Units

  • Device dimensions

    • Microns (micrometers) – 10-6

  • Oxide thickness

    • Angdstroms (A) or nanometers (nm) – 10-9

  • Wafer diameters

    • Millimeters(mm) or inches

    • Sometimes mils are used for wafer thickness or chip size

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Crystal growth, crystal structure

  • What is a semiconductor – so – so conductivity 

    • Insulator (0 - glass) – semiconductor – conductor (∞-gold)

  • Conductivity equation

      • Inverse of the resistance : 1/R

        • Proportional to current

    • Q = 1.602 * 10-19  (c) 

      • Electron charge

    • N – number of free electrons (e-)

    • P – number of free holes (h+)

    • Mn -  how fast the e- is moving

    • Mp – how fast the h+ is moving

    • To increase the conductivity, change the number of e- or h+

      • Dopant is the technique used change e- and h+ numbers

  • Resistivity

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    • Inverse of conductivity

    • Easy to vary resistivity of a semiconductor

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    • Semiconductor resititivty depends on carrier density and mobility

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Types of semiconductors

  • Elemental – using one material

  • Compound – uses more than one material

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  • Focus on Si, Ge, Ga and As

  • Group IV

    • Silicon is the most common

      • In most integrated cirucits and power devices

      • SIC for high temperature devices

  • Group III and V

    • GeAs is the most common

      • Used for light emitting de

      • High speed devices/circuits

      • Light emitting

        • GaN, GaAsP

      • Optical communication

        • GaInAsP

  • Group II and VI

    • Lightning arresters

      • ZnO

    • Infrared detectors

      • HgCdTe

Review Questions

  1. What material parameters determine the semiconductor resistivity?

  2. Which one material parameter influences the semiconductor resistivity the most?

  3. What does “group IV” etc. mean?

  4. Which groups form semiconductors?


Crystal growth, Crytal Structure

  • How to make a semiconductor

    • Bring single crystal seed into the melt

    • Dip seed into melt and withdraw slowly

    • Pull seed with proper pull rate and roation

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    • The ingot is pure silicone

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    • Czochraliski crystal growth

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    • Slicing process for making wafers

      • Wire coated in diamond splinters.

    • Cost for wafers

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    • How many cpu can you make with a single wafer

      • 1 cpu is 506 mm

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  • Crystals structure

    • Amorphous

      • Randomly distributed, working like an insulator

      • Glass

    • Polycrystalline

      • Metal, some organization, working like an conductor

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    • Single crystal

      • Semiconductor, pure silicone

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    • Simple cubic lattice

      • Only 1 atom in total actually in the box

      • Atoms on every corner

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    • Body centered cubic (bcc) lattice

      • Only 2 atoms in totally actually in the box

      • Atoms on every corner AND 1 in the middle

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    • Face centered cubic (fcc) lattice

      • Only 4 atoms actually in the box

      • Atoms on every corner AND 1 atom on the surface of each face of the cube

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  • Diamond latticue – fcc with 4 additional atoms

    • Only 8 atoms actually in the box

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  • Example

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  • Example

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    • Si = diamond lattice

      • 8 atoms in a diamond lattice divided by the area will give the number of atoms per cubic centimeter

  • Unit cell

    • A small portion of any crystal that could be used to reproduce the crystal

    • The original lattice can be readily reproduced by merely duplication the unit cell

    • The unit cell need not be primitive (the smallest unit cell possible)

Wafter orientation, miller indices

  • Wafter orientation

    • Millier indices

      • the surface of semiconductors wafers is specified by a set of number. These numbers are called 

      • the numbers that specify a wafter surface

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  • Surface orientation is critical in device processing steps and directly affects the characteristics.

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  • the atoms that make up the three principal planes in the diamond lattice

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  • Zincblende structure

    • Same as diamond structure EXCEPT there are two differ types of atoms in the lattice

      • Ex, GaAs, InP, GaP, GaN etc…

  • Crytal structure

    • Top view of zincblende structure showing the atoms in the three principle planes

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  • Direction

    • Set up a vector of arbitrary length in the direction of interest.

    • Decompose the vector into its components by projecting along the coordinate’s axes.

    • Normalize to lowest integers.

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  • Miller indices cannot be established for a plane passing through the origin of coordinates

    • The orgin of coordinates must be moved to a lattice point not on the plane to be indexed

    • The procedure is acceptable because of the equivalent nature of parallel planes

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Review questions

  1. What are miller indices

  2. How are they determined

  3. How many atoms are there in the (100) plane

  4. How many atoms are there in the three dimensional diamond lattice unit cell?

  5. What is the distance between (111) planes in a simple cubic lattice?

  6. What are the angles between (110) and (100) planes in a simple cubic lattice?









Energy levels, bonds, and bands

Energy levels

  • Electronic atom structure

    • Isolated atom – an atomic core or nucleus surrounded by electrons.

      • Various quantum numbers

      • Principle quantum number (n) – determines the energy of an election.

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      • Azimuthal quantum number (l) - determines the angular momentum magnitude.

        • For each value of n there are several l values that govern the spatial distribution of the electron

          • Each l value constitutes a subshell.

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Energy needed to use the electron at that specific level

Energy band diagram

  • When Si atoms are brought close to eachother, discrete energy levels broaden into bands.

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  • Conduction band (Ec) – higher band, can hold 8 electrons

  • Band gap (Eg) – electrons cannot exist in this gap, determines the characteristics of the device (ie metal, semiconductor, insulator)

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  • 1 eV = 1.602 x 10-19 J

    • The amount of energy gained/lost by the charge of a single election moved across an electric potential difference of 1 volt.

  • For silicone = 1.12 eV

  • For GaAs = 1.42 eV

  • Valence band (Ev) – lower band, can hold 8 electrons

  • Lower band gap energy = lower resistance = higher conducivity

Bonds and bands

  • Covalent bonds – stable

  • A crystal containing on Si atoms with no impurities gives rise to the conduction and valence bands with no levels in the band gap (forbidden zone)

  • At low temperatures, there are no electrons in the conduction band and no hoes in the valence band. Aka valence band is full. AND CURRENT = 0;

    • No bands are broken

    • Band electros in crystalline silcon are not tied to any one particular atom.

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    • As the temp of the SI crytal increases, some bonds break (electrons break loose),

      • Free elections – free electrons only in the conduction band

      • Free holes -  only in the valence band

  • Holes = where a electiron is missing


Current (i) = dQ/Dt

Q =  charge =  free elctrons and free holes

Election hole pari (EHP) – for every free hole/electron there is a free hole/electron

Dopant atoms – in Si have more or less than 4 electrons in the outermost shell

  • Donor

    • Group five atoms (P, As, Sb).

    • Have 5 electrons but Si only needs 4 for a colvant bond. Makes for a unstable condition making it easy to donate the extra electron

      • At low temps, insufficient energy to excite electro to conduction band

      • Higher temp, donor donates electron

    • N -type – more electrons than holes

  • Acceptor

    • Group 3 atoms (B, Ga, In)

    • Has three electron but si needs 4 for a covalent bond. Makes for an unstable condition meaning it need to accept an electron

      • At low temps, insufficient energy to excite hold to valence band

      • At higher temps, acceptor accepts electron

    • P – type – more holes than electrons



Intrinsic semiconductor – an extremely pure semiconductor sample containing any significant amount of impurity atom

  • N = number of electrons/cm^3

  • P = number of holes/cm^3

  • N = p = ni

    • Ni 

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Carriers

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Review questions

A si atom has how many electrons?

How many of these electrons are in the outermost shell?

What is the band gap?

Why is a semiconductor an insulator at low temperatures

What is a donor and how does it function

What is an acceptor and how does it function?







Density of states = # of chairs available for electrons

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Effective mass(Mn*) – of electrons within a crystal is a function of the semiconductor material and is different from the mass of electrons within a vacuum. Different from mass of electrons in the free space

  • Electrons moving in a vacuum

    • Electrons moving in a semiconductor crystal: collide with semiconductor atoms making it hard to calculate the speed of the atom

Fermi Function f(E), gives the probability of a state being occupied by an electron

  • Example, if the state density is 6 and the fermi function is 0.5, that means that half of the density will be filled aka we have 3 electrons

  • For E >= Ef + 3kT, the fermi function becomes the Boltzmann approximation (kT = 0.026 eV at T = 300k)

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  • Increasing temperature  = increase in probability of seeing e- in Ec =  decrease the probability of seeing e in Ev

Density state vs fermi function

  • Gc(E) – density of states - probability of finding an electron on a state

  • F(E) – fermi function - probability of those states being occupied

  • Gc(E) * f(E) = # of electron present

  • Gv(e) * (1 – f(e) ) = # of free holes

Review questions

What is the density of states g(e)?

How does g(e) depend on energy E?

What is an effective mass?

What is the fermi function f(e)

How does f(e) depend on temperature

What is the fermi energy or fermi level Ef

What is the occupancy of a state at e = Ef


Electron density – deponds on the density of states and on fermi function

  • N I the area under the (E – Ec) vs gc(e) * f(e) curve

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