Crystal Structures and Classical Theory of Conduction

Classification of Solids by Atomic Arrangement

  • Solids are categorized into three distinct groups based on the spatial arrangement of atoms:

    • Amorphous Solids: Atoms are positioned at random with no discernible pattern.

    • Crystalline Solids: Atoms exhibit a long-range order, forming a predictable structure across the material.

    • Polycrystalline Solids: Characterized by localized short-range order. They consist of many small crystalline regions, known as grains, which have random orientations and are separated by interfaces called grain boundaries.

Fundamental Properties of Crystal Structures

  • Periodicity: The most critical property of a crystal. It provides long-range order where local bonding geometry is repeated at regular intervals, resulting in a periodic array of atoms.

  • Predictability: Due to periodicity, the location of any atom within the crystal is predictable.

  • Prevalence: Nearly all metals, semiconductors, and ceramics exist in a crystalline state.

  • Constituents of a Crystal:

    • Lattice: A mathematical abstraction; a regular array of points in space showing distinguishable periodicity.

    • Basis: An identical group of atoms or molecules (identical in composition, arrangement, and orientation) placed at each lattice point.

    • Formula: Crystal=Lattice+BasisCrystal = Lattice + Basis.

The Unit Cell and Lattice Parameters

  • Unit Cell: The smallest convenient volume of a crystal that retains all the characteristics of the crystal structure. Repetition of the unit cell in three dimensions generates the entire crystal.

  • Representation: Usually represented by a parallelepiped.

  • Lattice Parameters:

    • The edges of the unit cell are defined along the x,y,zx, y, z axes as lengths a,b,ca, b, c.

    • The angles between these edges are defined as β\beta (between aa and cc), β\beta (between aa and cc), and β\beta (between aa and cc). Note: The transcript explicitly labels parameters as sides a,b,ca, b, c and angles β,β,β\beta, \beta, \beta. (Correction: usually β,β,β\beta, \beta, \beta are used, transcript shows β,β,β\beta, \beta, \beta diagrammatically for angles).

  • Bravais Lattices: There are 1414 distinct lattices possible in 3D space, grouped into 77 crystal systems.

The Seven Crystal Systems

  • Cubic System: a=b=ca = b = c; β=β=β=90°\beta = \beta = \beta = 90^°. Examples include Al, Cu, Fe, Pb, NaCl, CsCl, LiF, Si, and GaAs.

  • Tetragonal System: a=bca = b \neq c; β=β=β=90°\beta = \beta = \beta = 90^°. Examples: In, Sn, Barium Titanate, TiO2TiO_2.

  • Orthorhombic System: abca \neq b \neq c; β=β=β=90°\beta = \beta = \beta = 90^°. Examples: S, U, Pl, Ga (below 30°C30^°C), Iodine, Cementite (Fe3CFe_3C), Sodium Sulfate.

  • Rhombohedral System: a=b=ca = b = c; β=β=β90°\beta = \beta = \beta \neq 90^°. Examples: Arsenic, Boron, Bismuth, Antimony, Mercury (below 39°C-39^°C).

  • Hexagonal System: a=bca = b \neq c; β=β=90°\beta = \beta = 90^°; β=120°\beta = 120^°. Examples: Cadmium, Magnesium, Zinc, Graphite.

  • Monoclinic System: abca \neq b \neq c; β=β=90°\beta = \beta = 90^°; β90°\beta \neq 90^°. Examples: α\alpha-Selenium, Phosphorus, Lithium Sulfate, Tin Fluoride.

  • Triclinic System: abca \neq b \neq c; βββ90°\beta \neq \beta \neq \beta \neq 90^°. Example: Potassium dichromate.

Metallic Crystal Structures: FCC and BCC

  • Face-Centered Cubic (FCC):

    • Atoms are located at each corner of the cube and at the center of each face.

    • Effective Number of Atoms: (8×1/8)+(6×1/2)=4(8 \times 1/8) + (6 \times 1/2) = 4 atoms.

    • Geometry: The face diagonal is aβ(2)=4Ra\beta(2) = 4R, leading to a=2β(2)Ra = 2\beta(2)R.

    • Atomic Packing Factor (APF): Calculated as [4×(4/3)βR3]/a30.74[4 \times (4/3)\beta R^3] / a^3 ≈ 0.74 (74%74\% occupied).

    • Examples: Ag, Al, Au, Cu.

  • Body-Centered Cubic (BCC):

    • Atoms are located at each corner and one atom at the center of the unit cell.

    • Effective Number of Atoms: (8×1/8)+1=2(8 \times 1/8) + 1 = 2 atoms.

    • Geometry: The body diagonal is 4R4R, and (4R)2=3a2(4R)^2 = 3a^2, leading to a=(4/β(3))Ra = (4/\beta(3))R.

    • Atomic Packing Factor (APF): Calculated as [2×(4/3)βR3]/a30.68[2 \times (4/3)\beta R^3] / a^3 ≈ 0.68 (68%68\% occupied).

    • Examples: Alkali metals (Li, Na, K, Rb), Cr, Mo, W, Mn, α\alpha-Fe (below 912°C912^°C), β\beta-Ti (above 882°C882^°C).

  • Atomic Concentration (natn_{at}): defined as Number of atoms in unit cellVolume of unit cell\frac{\text{Number of atoms in unit cell}}{\text{Volume of unit cell}}.

    • For Ag (FCC): nat=4/a3=5.87×1022cm3n_{at} = 4/a^3 = 5.87 \times 10^{22} cm^{-3}.

    • For Fe (BCC): nat=2/a3=8.5×1022cm3n_{at} = 2/a^3 = 8.5 \times 10^{22} cm^{-3}.

Diamond and Zinc Blende Structures

  • Diamond Structure:

    • Space lattice is FCC.

    • Basis consists of two identical atoms: one at (0,0,0)(0,0,0) and one at (1/4,1/4,1/4)(1/4, 1/4, 1/4).

    • Bonding is directional tetrahedral covalent bonding.

    • Coordination: Each atom has 44 nearest neighbors and 1212 next-nearest neighbors.

    • Packing Efficiency: Very low; only 34%34\% filled.

    • Examples: C, Si, Ge.

  • Zinc Blende Structure:

    • Similar to diamond lattice but uses a basis of two non-identical atoms.

    • Examples: ZnS, GaAs.

Miller Indices for Planes and Directions

  • Importance: Properties like elastic modulus, electrical resistivity, and magnetic susceptibility are directional (anisotropic). Processes like oxidation and etching depend on specific planes.

  • Calculating Miller Indices for Planes (hklhkl):

    1. Find intercepts of the plane with the axes (as multiples of a,b,ca, b, c).

    2. Take the reciprocals of these intercepts.

    3. Reduce to the smallest set of integers h,k,lh, k, l.

    • Note: If a plane is parallel to an axis, the intercept is infinity and the index is 00. Negative intercepts are denoted with a bar above the number (e.g., hˉ\bar{h}).

  • Family of Planes: Denoted by hkl{hkl}, representing equivalent planes (e.g., 100{100} includes (100)(100), (010)(010), and (001)(001)).

  • Crystal Directions: Denoted by [hkl][hkl], based on vector components. Families of directions are denoted by hkl\langle hkl \rangle.

Planar Concentration of Atoms

  • Definition: The number of atoms per unit area on a specific (hkl)(hkl) plane.

  • FCC Planar Densities (e.g., for Silver, a=0.4084nma = 0.4084 nm):

    • (100) Plane: n(100)=2/a2=12×1018atoms/m2n(100) = 2 / a^2 = 12 \times 10^{18} atoms/m^2.

    • (110) Plane: n(110)=2/(β(2)a2)=8.5×1018atoms/m2n(110) = 2 / (\beta(2)a^2) = 8.5 \times 10^{18} atoms/m^2.

    • (111) Plane: Most densely packed. n(111)=2/[a2(β(3)/2)]=13.8×1018atoms/m2n(111) = 2 / [a^2(\beta(3)/2)] = 13.8 \times 10^{18} atoms/m^2.

  • Diamond Planar Densities (a=0.5659nma = 0.5659 nm):

    • (110) Plane: n(110)=8.8atoms/nm2n(110) = 8.8 atoms/nm^2.

    • (111) Plane: n(111)=7.2atoms/nm2n(111) = 7.2 atoms/nm^2.

    • (100) Planes: Least planar concentration in diamond.

Crystalline Defects

  • Point Defects (0D):

    • Vacancies: Missing atoms at lattice points. They exist in thermal equilibrium (thermodynamic defects). Concentration formula: nv=NeEv/kTn_v = N e^{-E_v / kT}, where EvE_v is activation energy, kk is Boltzmann’s constant (1.38×1023J/K1.38 \times 10^{-23} J/K), and TT is temperature in Kelvin.

    • Impurities: Substitutional (occupy lattice sites, e.g., As in Si) or Interstitial (occupy spaces between sites, e.g., C in Fe). Doping is the intentional addition of impurities to alter electrical properties.

  • Line Defects (1D) - Dislocations:

    • Edge Dislocation: An extra half-plane of atoms terminates within the crystal. Creates strain fields (compression above, tension below).

    • Screw Dislocation: Result of shearing; the crystal lattice follows a helical path.

    • Nature: Non-equilibrium defects arising from stress or growth.

  • Planar Defects (2D):

    • Grain Boundaries: Interfaces between grains in polycrystalline solids. They are high-energy regions with broken (dangling) bonds, voids, and strained bonds. Atoms diffuse more easily along these boundaries.

Real Crystal Surfaces

  • Real surfaces lack infinite periodicity and exhibit unique features:

    • Dangling Bonds: Incomplete bonds at the surface (e.g., Si surface atoms have one unpaired electron).

    • Reconstruction: Surface atoms rearrange to share dangling bonds, causing slight displacement.

    • Chemisorption: Foreign atoms (e.g., O, H) form primary chemical bonds with dangling bonds.

    • Physisorption: Molecules (e.g., polar water) form secondary physical bonds with the surface.

Classical Theory of Electrical Conduction: The Drude Model

  • Drude Model (1900): Assumes metals contain free electrons that move randomly like particles in a gas, obeying Newton's laws.

  • Current Density (JJ): J=I/A=q/(At)J = I/A = q/(At).

  • Drift Velocity (vdv_d): The average velocity gained by electrons in the direction of an applied electric field EE.

    • Relation: vdx=(eτ/me)Exv_{dx} = (e τ / m_e) E_x, where ττ is the mean scattering time (relaxation time).

  • Resistivity (ρρ): ρ=1/σρ = 1 / σ.

  • Conductivity (σσ): 0˘3C3=enμd\u03C3 = e n μ_d.

  • Drift Mobility (μdμ_d): 0˘3BCd=eτ/me\u03BC_d = e τ / m_e.

  • Problem (Copper at Room Temp):

    • Given: 0˘3C3=5.9×105Ω1cm1\u03C3 = 5.9 \times 10^5 Ω^{-1}cm^{-1}, Density =8.96g/cm3= 8.96 g/cm^3, Atomic mass =63.5g/mol= 63.5 g/mol.

    • Calculated concentration n=8.5×1022cm3n = 8.5 \times 10^{22} cm^{-3}.

    • Mobility 0˘3BCd=43.4cm2/Vs\u03BC_d = 43.4 cm^2/Vs.

Temperature Dependence of Resistivity

  • Ideal Pure Metals: Scattering is caused by thermal lattice vibrations.

    • Mean free path l=uτl = u τ.

    • Scattering frequency depends on cross-sectional area S=πa2S = π a^2, where aa is vibration amplitude.

    • Since average kinetic energy (1/4)Ma2ω2(1/2)kT(1/4) M a^2 ω^2 ≈ (1/2) kT, the area a2Ta^2 ∝ T.

    • Therefore, 0˘3C1T\u03C1 ∝ T (for pure metals at room temp).

  • Metallic Alloys and Matthiessen’s Rule: Total resistivity is the sum of independent scattering processes:

    • 0˘3C1=ρT+ρI+ρD\u03C1 = ρ_T + ρ_I + ρ_D.

    • 0˘3C1T\u03C1_T: Temperature-dependent (lattice vibrations).

    • 0˘3C1I\u03C1_I: Temperature-independent (impurities).

    • Matthiessen's Rule: 0˘3C1=AT+B\u03C1 = AT + B.

  • Temperature Coefficient of Resistivity (TCR):

    • 0˘3B10=Δρ/(ρ0ΔT)\u03B1_0 = Δρ / (ρ_0 ΔT).

    • 0˘3C1=ρ0[1+α0(TT0)]\u03C1 = ρ_0 [1 + α_0(T - T_0)].

    • Below the Debye temperature, 0˘3C1\u03C1 decreases rapidly because the number of phonons energetic enough to scatter electrons drops off.

The Hall Effect

  • Phenomenon: When a magnetic field BzB_z is perpendicular to current density JxJ_x, a transverse electric field EHE_H (Hall field) is generated in the yy-direction.

  • Hall Field: EH=RHJxBzE_H = R_H J_x B_z.

  • Hall Coefficient (RHR_H): For electrons, RH=1/enR_H = -1/en.

  • Hall Voltage (VHV_H): VH=(RHIxBz)/DV_H = (R_H I_x B_z) / D, where DD is the thickness.

  • Applications: Measuring charge carrier concentration (nn) and identifying carrier type. Semiconductors have larger RHR_H than metals, making them more suitable for Hall devices.

  • Hall-Effect Wattmeter: Uses a semiconductor sample to measure electrical power (P=VLILP = V_L I_L). Hall voltage VHILBzV_H ∝ I_L B_z and BzVLB_z ∝ V_L, thus VHPV_H ∝ P.

Thermal Conduction

  • In Metals: Heat is primarily transported by the free electron gas. Energetic electrons at the hot end transfer energy to the cold end via collisions with atoms.

  • Fourier’s Law: Q=κA(δT/δx)Q' = κ A (δT / δx), where κκ is thermal conductivity.

  • Wiedemann-Franz-Lorenz Law: Relates electrical (σσ) and thermal (κκ) conductivity:

    • 0˘3BA/σT=CWFL\u03BA / σ T = C_{WFL}.

    • Lorenz number CWFL=2.44×108WΩK2C_{WFL} = 2.44 \times 10^{-8} WΩK^{-2}.

  • In Non-Metals: Heat is conducted via lattice vibrations (phonons). Atomic vibrations are coupled through bonds. Stronger bonds (e.g., Diamond) result in higher thermal conductivity.

Thermal Resistance (θθ)

  • Analogy: Thermal conduction is analogous to Ohm’s Law.

    • Electrical: I=V/RelecI = V / R_{elec}, where Relec=L/(σA)R_{elec} = L / (σ A).

    • Thermal: Q=ΔT/θQ' = ΔT / θ, where 0˘3B8=L/(κA)\u03B8 = L / (κ A).

  • Problem (Brass Disk):

    • Given: 0˘3C1=50nΩm\u03C1 = 50 nΩm, Q=10WQ' = 10 W, diameter =20mm= 20 mm, thickness =30mm= 30 mm.

    • Step 1: Find thermal conductivity 0˘3BA\u03BA using Wiedemann-Franz Law: 0˘3BA146Wm1K1\u03BA ≈ 146 W m^{-1}K^{-1}.

    • Step 2: Calculate thermal resistance 0˘3B8=L/(κA)=0.65K/W\u03B8 = L / (κ A) = 0.65 K/W.

    • Step 3: Temperature drop 0˘394T=Qθ=10W×0.65K/W=6.5°C\u0394T = Q' θ = 10 W \times 0.65 K/W = 6.5 °C.