Structures and Energetics of Metallic and Ionic Solids - Part I

Inorganic Chemistry I (CHEM 3341) Fall 2025

  • Instructor: Dr. Mario Wriedt
  • Institution: The University of Texas at Dallas, Richardson, TX
  • Topic: Structures and energetics of metallic and ionic solids - Part I
  • Date: 09/15/2025

Course Topics

  • Types of solids
  • Packing of spheres
  • Homework: Read Chapter 6, pages 172176172-176

Structures of Solids

Categories of Solid State Materials
  • Amorphous solids
    • Atoms or molecules have order over only short distances (a few atomic or molecular spacings).
    • Do not exhibit a crystal structure.
    • Characterized by an irregular bonding pattern.
    • Examples: Rubber, plastic, glass.
      • Rubber (cis-polyisoprene): May be soft and rubbery when formed by long, tangled molecules, held by intermolecular forces.
      • Vulcanization: Process involving sulfur linkages (SxS_x) to form a more rigid rubber.
      • Glassy solids: Hard and brittle, formed by atoms irregularly joined by covalent bonds.
  • Semi-crystalline/-amorphous solids
    • Crystallinity is usually specified as a percentage of the volume of the material that is crystalline.
    • Examples: Ceramics and some polymers.
  • Crystalline solids
    • Atoms or molecules are arranged in a regular, periodic manner (long-range order).
Six Types of Solids
  1. Ionic solids

  2. Metallic solids

  3. Network atomic solids

  4. Atomic solids

  5. Molecular solids

  6. Amorphous solids

    (Note: Types 151-5 are crystalline solids)

1. Ionic Solids
  • Formed by electrostatic attraction between anions and cations, creating a crystal lattice.
  • Each ion is surrounded by ions of the opposite charge.
  • Come in three basic forms based on interstitial holes:
    • Trigonal holes
    • Tetrahedral holes
    • Octahedral holes
  • Smaller ions typically fill these holes, while larger ions form the primary structure.
  • Extremely stable: Significant energy is required to break the strong ionic bonds, leading to high melting points.
  • Example: NaClNaCl (Halite structure).
2. Metallic Solids
  • Formed by positively charged nuclei of metal atoms held together by valence electrons (metal bond).
  • Electrons are "delocalized", meaning they are not bound to specific atoms.
  • These delocalized electrons can move throughout the solid, described by the "electron sea model" (positive nuclei float in a sea of negative electrons).
  • Characteristics:
    • High thermal and electrical conductivity.
    • Typically hard, shiny, and ductile.
  • Example: CuCu (Face-centered cubic (fcc) structure).
3. Network Atomic Solids
  • Consist of atoms held together by strong covalent bonds.
  • Characteristics:
    • Incredibly hard.
    • High melting points.
    • Poor conductors of heat and electricity.
  • Examples:
    • SiO2SiO_2
    • Diamond (CC)
    • Many gemstones.
4. Atomic Solids
  • Formed when weak London Dispersion Forces bind atoms of cold noble gases.
  • Not seen in everyday life: Require extremely low temperatures.
  • Examples: Solid krypton, solid argon.
London Dispersion Forces (LDF)
  • Weakest intermolecular force.
  • A temporary attractive force resulting from temporary dipoles formed when electrons in two adjacent atoms briefly occupy positions that make the atoms polar.
  • This temporary dipole in one atom can induce a dipole in a nearby atom (induced dipole-induced dipole attraction).
  • These attractive forces cause nonpolar substances to condense into liquids and freeze into solids when the temperature is lowered sufficiently.
5. Molecular Solids
  • Comprised of discrete molecules held together by intermolecular forces, which are considerably weaker than intramolecular (covalent) forces.
  • Intermolecular forces involved:
    • London Dispersion Forces
    • Dipole-dipole interactions
    • Hydrogen bonds
  • Characteristics:
    • Fairly soft.
    • Poor electrical and thermal conductors.
    • Low to moderate melting points.
  • Examples:
    • I2I_2
    • S8S_8

Packing of Spheres

Close-Packing
  • Regular arrangement of spheres where every sphere is in contact with six other spheres, forming a hexagonal arrangement in a layer.
  • Building layers:
    • The second layer is built by placing spheres in the hollows of the first layer.
    • In the second layer, two types of hollows are formed:
      • Hollows that lie directly over hollows in layer 11.
      • Hollows that lie directly over spheres in layer 11.
Hexagonal Close-Packing (hcp) and Cubic Close-Packing (ccp)
  • Two different close-packed arrangements are possible:
    • Hexagonal close-packing (hcp): Characterized by two repeating layers (e.g., ABABABABABAB… sequence).
    • Cubic close-packing (ccp): Characterized by three repeating layers (e.g., ABCABCABCABCABCABC… sequence).
  • Coordination number for both hcp and ccp is 1212. (66 in the same layer, 33 above, 33 below).
Unit Cell
  • A fundamental concept in solid-state chemistry.
  • The smallest repeating unit of a crystal structure.
  • When unit cells are stacked in 3D space, they describe the bulk arrangement of atoms in the crystal.
  • Represented by its lattice parameters:
    • Lengths of the cell edges: a,b,ca, b, c
    • Angles between them: α,β,γ\alpha, \beta, \gamma
  • Types of Cubic Unit Cells:
    • Simple cubic (P)
    • Body-centered cubic (I or bcc)
    • Face-centered cubic (F or fcc)
  • Relationship between ccp and fcc: The ccp arrangement (ABCABC…) is clearly reflected by the face-centered cubic (fcc) unit cell. The hcp arrangement (ABAB…) is easily recognized in its own unit cell.
Packing in Metals
  • Common arrangements for metals include:
    • Face-centered cubic (fcc), which is also cubic close-packing (ccp).
    • Body-centered cubic (bcc).
Interstitial Holes
  • These are spaces between the spheres in a packed structure.
  • Tertrahedral holes:
    • Surrounded by 44 spheres.
    • Spheres lie at the corners of a tetrahedron.
  • Octahedral holes:
    • Surrounded by 66 spheres.
    • Spheres lie at the corners of an octahedron.
  • Numerical relationship: In a close-packed structure, there is one octahedral hole per sphere and twice as many tetrahedral holes as octahedral holes.
  • Size comparison: Octahedral holes are larger than tetrahedral holes.
Most Frequent Packings of Metals (Space Filling Efficiencies)
  • Hexagonal close-packing (hcp): 74%74\% space filling.
  • Cubic close-packing (ccp) / Face-centered cubic (fcc): 74%74\% space filling.
  • Body-centered cubic (bcc): 68%68\% space filling.
Non-Close-Packing
  • These arrangements have lower space-filling efficiencies and coordination numbers.
  • Simple cubic lattice:
    • Coordination number = 66
  • Body-centered cubic (bcc) lattice:
    • Coordination number = 88