Semiconductor Devices
Power Semiconductor Devices
- Power diodes, Bipolar junction transistor, Field Effect transistor, MOSFET, IGBT, SCR.
- SCR-VI characteristics.
- Introduction to Power Converters: Diode rectifier, controlled rectifier, Inverter, DC to DC converters.
Concept of Power Electronics
- Power Electronics is related to both Power and Electronics engineering.
- Power engineering focuses on efficient electrical energy generation, transmission, and utilization.
- Electronics engineering focuses on distortion-less data transmission at low power levels.
Power Semiconductors
- Power Electronics applies electronic principles at the power level.
- Uses semiconductor power switches like thyristors and MOSFETs.
- Efficient, withstand high voltage and current with fewer losses.
- Used for switching, inverters/converters, and power amplifiers.
- Commonly made of silicon (Si), with silicon carbide (SiC) and gallium nitride (GaN) also used.
Types of Semiconductor Devices
- Power Diodes
- Thyristors
- Transistors
Power Semiconductor Devices
- Power diodes.
- BJT (Bipolar Junction Transistor).
- MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
- IGBT (Insulated Gate Bipolar Transistor).
- SCR (Silicon Controlled Rectifier).
- BJTs, MOSFETs, and IGBTs are controllable switches, turned on/off by control signals.
Power Diodes
- Consist of a PN junction.
- Conduct when forward biased.
- Allow current in one direction (anode to cathode), acting as an electrical valve.
V-I Characteristics of Diodes
- Made of silicon p-n junction with anode and cathode terminals.
- Forward biased when the anode is positive relative to the cathode.
- Conduct fully when diode voltage exceeds the cut-in voltage (0.7V for Si).
- Reverse biased when the cathode is positive relative to the anode.
- Small leakage current flows when reverse biased.
- Leakage current increases with reverse voltage until breakdown voltage is reached.
Bipolar Junction Transistor (BJT)
- Three-terminal semiconductor device with two p-n junctions.
- Used as amplifiers or current-controlled devices in electronic circuits.
- Electrons and holes act as charge carriers.
- Terminals: base, emitter, and collector.
- Less current flows between base and emitter; larger current between collector and emitter.
- Types: NPN and PNP.
- Operating Regions:
- Active: operates as an amplifier.
- Saturation: fully on, acts as a switch with collector current equal to saturation current.
- Cut-off: fully off, collector current is zero.
- Applications: Amplifiers and switches in devices like mobile phones and TVs.
Field Effect Transistor (FET)
- Uses an electric field to control current flow in a semiconductor.
- Consists of a channel with drain and source electrodes at either end.
- Three terminals: source, gate, and drain.
- Current flow between source and drain is controlled by the gate.
- Voltage at the gate modulates charge carriers, affecting current flow.
- Types: Junction-gate FET (JFET) and Metal-Oxide-Semiconductor FET (MOSFET).
- Also known as unipolar transistors.
FET Working
- Applying voltage to the gate creates an electric field and a depletion region in the channel.
- The depletion region reduces free charge carriers, reducing channel conductivity.
- In n-type FET, negative gate voltage reduces electron flow.
- In p-type FET, positive gate voltage reduces hole flow.
- Varying gate voltage modulates current flow.
FET Characteristics
- Electric charge flows through a semiconducting channel between source and drain.
- High input impedance at low frequencies.
- MOSFET is the most widely used type.
- Designed for high power levels.
- Voltage-controlled.
- Acts as electrical switches and amplifiers, controlling current flow based on gate voltage.
- Types:
- Depletion Mode: Requires Gate-Source voltage (VGS) to switch "OFF" (normally closed).
- Enhancement Mode: Requires Gate-Source voltage (VGS) to switch "ON" (normally open).
- Four terminals: source (S), gate (G), drain (D), and body (B) (often body is connected to the source).
- The width of a channel along which charge carriers flow (electrons or holes).
MOSFET Construction
- Drain and source are heavily doped N+ regions, substrate is p-type.
- Current flows due to negatively charged electrons (n-channel MOSFET).
- Gate electrode is insulated from the semiconductor by a silicon dioxide layer.
- The input resistance of the MOSFET is extremely high way up in the Mega-ohms (MΩ)
- Charge carriers enter at the source and exit via the drain.
Applications of MOSFETs
- Switching and amplification in electronic circuits.
- Fast switching and amplification of small signals.
- Power regulation in DC motors.
- Chopper circuits (high switching speed).
- Microcontrollers and microprocessors (high efficiency and low power consumption).
- SMPS (Switch Mode Power Supply).
- H bridge circuit, buck converters and boost converters.
Comparison of BJT and MOSFET
- Full Form: BJT (Bipolar Junction Transistor), MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
- Definition: BJT is a three-terminal device for switching and amplification; MOSFET is a four-terminal device for switching.
- Types: BJT (NPN and PNP), MOSFET (P/N-channel enhancement/depletion).
- Terminals: BJT (emitter, base, collector), MOSFET (source, drain, gate, body).
- Charge Carriers: BJT (electrons and holes), MOSFET (electrons or holes).
- Polarity: BJT (bipolar), MOSFET (unipolar).
- Controlling Quantity: BJT (current-controlled), MOSFET (voltage-controlled).
- Input Impedance: BJT (low), MOSFET (high).
- Temperature Coefficient: BJT (negative), MOSFET (positive).
- Switching Frequency: BJT (low), MOSFET (high).
- Power Consumption: BJT (more), MOSFET (less).
- Losses: BJT (high switching losses, lower conduction losses), MOSFET (lower switching losses, high on-resistance and conduction losses).
- Applications: BJT (low current applications, amplifiers, oscillators), MOSFET (high power applications, power supplies).
Insulated Gate Bipolar Transistor (IGBT)
- Combines qualities of BJT and MOSFET.
- High input impedance (MOSFET) and low on-state power loss (BJT).
- Used as an electronic switch with fast switching and high efficiency.
IGBT Characteristics
- Combines MOSFET and BJT characteristics for high current and low saturation voltage.
- Integrates an isolated gate using a FET for control input.
- Three terminals: Emitter, Gate, Collector.
- "Insulated Gate" (MOSFET input) has very high input impedance.
- "Bipolar" (BJT output) has bipolar nature with current flow due to both types of charge carriers.
- Consists of four alternating layers (P-N-P-N) controlled by a metal-oxide semiconductor (MOS) gate.
- Allows handling of large currents and voltages using small voltage signals.
- It is a voltage-controlled device.
IGBT Construction
- Made of four semiconductor layers forming a PNPN structure.
- Collector (C) electrode attached to P layer.
- P+ substrate used with an N- layer on top forming PN junction J1.
- Two P regions fabricated on top of N- layer forming PN junction J2.
- N+ regions diffused over the P region.
- Emitter and gate are metal electrodes; the gate is insulated using silicon dioxide.
- Base P+ layer injects holes into the N- layer (injector layer).
- The N- layer is the drift region, thickness proportional to voltage blocking capacity.
- The P layer above is the body of IGBT.
- The N- layer has a path for current flow between emitter and collector via a channel created by the voltage at the gate electrode.
Applications of IGBT
- Power electronics applications: inverters, converters, and power supplies.
- Switching power supplies in high power applications, variable frequency drives (VFD), electric cars, trains.
- Motor drive systems, uninterruptible power supplies, induction cookers.
- Inverters in home appliances (air conditioners and refrigerators), industrial motors, and automotive main motor controllers.