Semiconductor Devices

Power Semiconductor Devices

  • Power diodes, Bipolar junction transistor, Field Effect transistor, MOSFET, IGBT, SCR.
  • SCR-VI characteristics.
  • Introduction to Power Converters: Diode rectifier, controlled rectifier, Inverter, DC to DC converters.

Concept of Power Electronics

  • Power Electronics is related to both Power and Electronics engineering.
  • Power engineering focuses on efficient electrical energy generation, transmission, and utilization.
  • Electronics engineering focuses on distortion-less data transmission at low power levels.

Power Semiconductors

  • Power Electronics applies electronic principles at the power level.
  • Uses semiconductor power switches like thyristors and MOSFETs.
  • Efficient, withstand high voltage and current with fewer losses.
  • Used for switching, inverters/converters, and power amplifiers.
  • Commonly made of silicon (Si), with silicon carbide (SiC) and gallium nitride (GaN) also used.

Types of Semiconductor Devices

  • Power Diodes
  • Thyristors
  • Transistors

Power Semiconductor Devices

  • Power diodes.
  • BJT (Bipolar Junction Transistor).
  • MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
  • IGBT (Insulated Gate Bipolar Transistor).
  • SCR (Silicon Controlled Rectifier).
  • BJTs, MOSFETs, and IGBTs are controllable switches, turned on/off by control signals.

Power Diodes

  • Consist of a PN junction.
  • Conduct when forward biased.
  • Allow current in one direction (anode to cathode), acting as an electrical valve.

V-I Characteristics of Diodes

  • Made of silicon p-n junction with anode and cathode terminals.
  • Forward biased when the anode is positive relative to the cathode.
  • Conduct fully when diode voltage exceeds the cut-in voltage (0.7V for Si).
  • Reverse biased when the cathode is positive relative to the anode.
  • Small leakage current flows when reverse biased.
  • Leakage current increases with reverse voltage until breakdown voltage is reached.

Bipolar Junction Transistor (BJT)

  • Three-terminal semiconductor device with two p-n junctions.
  • Used as amplifiers or current-controlled devices in electronic circuits.
  • Electrons and holes act as charge carriers.
  • Terminals: base, emitter, and collector.
  • Less current flows between base and emitter; larger current between collector and emitter.
  • Types: NPN and PNP.
  • Operating Regions:
    • Active: operates as an amplifier.
    • Saturation: fully on, acts as a switch with collector current equal to saturation current.
    • Cut-off: fully off, collector current is zero.
  • Applications: Amplifiers and switches in devices like mobile phones and TVs.

Field Effect Transistor (FET)

  • Uses an electric field to control current flow in a semiconductor.
  • Consists of a channel with drain and source electrodes at either end.
  • Three terminals: source, gate, and drain.
  • Current flow between source and drain is controlled by the gate.
  • Voltage at the gate modulates charge carriers, affecting current flow.
  • Types: Junction-gate FET (JFET) and Metal-Oxide-Semiconductor FET (MOSFET).
  • Also known as unipolar transistors.

FET Working

  • Applying voltage to the gate creates an electric field and a depletion region in the channel.
  • The depletion region reduces free charge carriers, reducing channel conductivity.
  • In n-type FET, negative gate voltage reduces electron flow.
  • In p-type FET, positive gate voltage reduces hole flow.
  • Varying gate voltage modulates current flow.

FET Characteristics

  • Electric charge flows through a semiconducting channel between source and drain.
  • High input impedance at low frequencies.
  • MOSFET is the most widely used type.

MOSFET (Metal Oxide Semiconductor Field Effect Transistor)

  • Designed for high power levels.
  • Voltage-controlled.
  • Acts as electrical switches and amplifiers, controlling current flow based on gate voltage.
  • Types:
    • Depletion Mode: Requires Gate-Source voltage (VGS) to switch "OFF" (normally closed).
    • Enhancement Mode: Requires Gate-Source voltage (VGS) to switch "ON" (normally open).
  • Four terminals: source (S), gate (G), drain (D), and body (B) (often body is connected to the source).
  • The width of a channel along which charge carriers flow (electrons or holes).

MOSFET Construction

  • Drain and source are heavily doped N+ regions, substrate is p-type.
  • Current flows due to negatively charged electrons (n-channel MOSFET).
  • Gate electrode is insulated from the semiconductor by a silicon dioxide layer.
  • The input resistance of the MOSFET is extremely high way up in the Mega-ohms (MΩ)( M\Omega )
  • Charge carriers enter at the source and exit via the drain.

Applications of MOSFETs

  • Switching and amplification in electronic circuits.
  • Fast switching and amplification of small signals.
  • Power regulation in DC motors.
  • Chopper circuits (high switching speed).
  • Microcontrollers and microprocessors (high efficiency and low power consumption).
  • SMPS (Switch Mode Power Supply).
  • H bridge circuit, buck converters and boost converters.

Comparison of BJT and MOSFET

  • Full Form: BJT (Bipolar Junction Transistor), MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
  • Definition: BJT is a three-terminal device for switching and amplification; MOSFET is a four-terminal device for switching.
  • Types: BJT (NPN and PNP), MOSFET (P/N-channel enhancement/depletion).
  • Terminals: BJT (emitter, base, collector), MOSFET (source, drain, gate, body).
  • Charge Carriers: BJT (electrons and holes), MOSFET (electrons or holes).
  • Polarity: BJT (bipolar), MOSFET (unipolar).
  • Controlling Quantity: BJT (current-controlled), MOSFET (voltage-controlled).
  • Input Impedance: BJT (low), MOSFET (high).
  • Temperature Coefficient: BJT (negative), MOSFET (positive).
  • Switching Frequency: BJT (low), MOSFET (high).
  • Power Consumption: BJT (more), MOSFET (less).
  • Losses: BJT (high switching losses, lower conduction losses), MOSFET (lower switching losses, high on-resistance and conduction losses).
  • Applications: BJT (low current applications, amplifiers, oscillators), MOSFET (high power applications, power supplies).

Insulated Gate Bipolar Transistor (IGBT)

  • Combines qualities of BJT and MOSFET.
  • High input impedance (MOSFET) and low on-state power loss (BJT).
  • Used as an electronic switch with fast switching and high efficiency.

IGBT Characteristics

  • Combines MOSFET and BJT characteristics for high current and low saturation voltage.
  • Integrates an isolated gate using a FET for control input.
  • Three terminals: Emitter, Gate, Collector.
  • "Insulated Gate" (MOSFET input) has very high input impedance.
  • "Bipolar" (BJT output) has bipolar nature with current flow due to both types of charge carriers.
  • Consists of four alternating layers (P-N-P-N) controlled by a metal-oxide semiconductor (MOS) gate.
  • Allows handling of large currents and voltages using small voltage signals.
  • It is a voltage-controlled device.

IGBT Construction

  • Made of four semiconductor layers forming a PNPN structure.
  • Collector (C) electrode attached to P layer.
  • P+ substrate used with an N- layer on top forming PN junction J1.
  • Two P regions fabricated on top of N- layer forming PN junction J2.
  • N+ regions diffused over the P region.
  • Emitter and gate are metal electrodes; the gate is insulated using silicon dioxide.
  • Base P+ layer injects holes into the N- layer (injector layer).
  • The N- layer is the drift region, thickness proportional to voltage blocking capacity.
  • The P layer above is the body of IGBT.
  • The N- layer has a path for current flow between emitter and collector via a channel created by the voltage at the gate electrode.

Applications of IGBT

  • Power electronics applications: inverters, converters, and power supplies.
  • Switching power supplies in high power applications, variable frequency drives (VFD), electric cars, trains.
  • Motor drive systems, uninterruptible power supplies, induction cookers.
  • Inverters in home appliances (air conditioners and refrigerators), industrial motors, and automotive main motor controllers.