Lecture 05 Flashcards

Non-Traditional Machining Using Mechanical Energy

Abrasive Jet Machining (AJM)

  • Material removal:
    • Surface Erosion
    • Mechanical Abrasion
    • Micro-chipping
    • Brittle fracture
  • Process parameters:
    • Abrasive material: Al<em>2O</em>3Al<em>2O</em>3 / SiC
    • Size: 10 ~ 50 μm
    • Carrier gas: air, CO<em>2CO<em>2, N</em>2N</em>2
    • Velocity: 500 ~ 700 m/s
    • Pressure: 2 ~ 10 bar
    • Abrasive jet velocity: 100 ~ 300 m/s
    • Stand-off distance: 0.5 ~ 5 mm
    • Nozzle impingement angle: 600 ~ 900
    • Nozzle Diameter (internal): 0.2 ~ 0.8 mm
  • Nozzle-Tip-Distance (NTD):
    • Cutting: 0.75 mm
    • Cleaning and peening: 5-12 mm
    • Glass frosting: 25-75mm

Water Jet Machining (WJM) and Abrasive Water Jet Machining (AWJM)

  • WJM:
    • High-pressure water jet (2500 – 4000 bar, 1000 m/s)
    • Suitable for leather, textile materials, food, polymers, thin metals
  • AWJM:
    • Abrasive particles mixed with high-pressure water
    • Used for metals and ceramics
  • WJM vs AWJM:
    • WJM: Pure water jet
    • AWJM: Water-abrasive mixture
    • AWJM cost of abrasive is an additional expenditure
    • WJM cuts softer materials, wood, leather, polymer and food items.
    • AWJM applications range from wood and polymer to metal cutting industries
  • AWJM Components:
    • High pressure intensifier
    • Waterjet
    • Abrasive feed system
    • Abrasive-jet nozzle
    • Abrasive and water catcher
  • AWJM General conditions:
    • Orifice: Sapphires - 0.1 to 0.3 mm
    • Focussing Tube: WC - 0.8 to 2.4 mm
    • Pressure: 2500 to 4000 bar
    • Abrasive: garnet and olivine - #125 to #60
    • Abrasive flow - 0.1 to 1.0 Kg/min

Ultrasonic Machining (USM)

  • Abrasives in slurry driven against work by tool oscillating at: low amplitude (25-100 microns) and high frequency (15-30 kHz).
  • USM Apparatus:
    • Power generator
    • Electroacoustic transducer
    • Mechanical amplifier
    • Sonotrode
  • Transducers:
    • Piezoelectric
    • Magnetostrictive
  • Material Removal:
    • Mechanical abrasion
    • Microchipping
    • Surface erosion by cavitation