ES exam 2

0.0(0)
studied byStudied by 2 people
learnLearn
examPractice Test
spaced repetitionSpaced Repetition
heart puzzleMatch
flashcardsFlashcards
Card Sorting

1/102

flashcard set

Earn XP

Description and Tags

Study Analytics
Name
Mastery
Learn
Test
Matching
Spaced

No study sessions yet.

103 Terms

1
New cards
What loading type is shown?
What loading type is shown?
Tension
2
New cards
What loading type is shown?
What loading type is shown?
Compression
3
New cards
What loading type is shown?
What loading type is shown?
Shear
4
New cards
Stress definition, equation, and units
distribution of internal forces, (o = F/A), Pascal (N/m^2) or Psi (pound force per square inch)
5
New cards
Strain definition, equation, and units
deformation within the body, (delta L/L), dimensionless
6
New cards
What are the assumptions in “engineering stress” and “engineering strain” calculations
take original cross-sectional area and don’t consider shrinkage/bulging
7
New cards
What type of testing is done to find the mechanical properties of materials
tensile test
8
New cards
Elastic deformation is
non-permanent and reversable
9
New cards
If the elastic modulus (E), is large, the material is ______,__ and deforms _____
stiff, less
10
New cards
How does the elastic modulus(E) compare for the three main materials?
Ceramics>metals>composites
11
New cards
Describe hooke’s law as it applies to elastic modulus
o = Ee, relates stress to strain for linear elastic deformation
12
New cards
What’s the use of Poisson’s ratio and how is it calculated?
ratio between axial and transverse deformation, v =-ex/ez
13
New cards
Explain the difference between elastic and plastic deformations
elastic is temporary since any deformation goes back to 1, while plastic is permanent and non-reversible
14
New cards
deflection is dependent on
material, geometric, and loading parameters
15
New cards
yield strength
stress value that marks the transition form elastic to plastic deformation
16
New cards
tensile strength
highest point of stress/strain curve, max stress before failure
17
New cards
ductility and ways of calculating it
amount of plastic deformation before failure, %EL = how much it can elongate, % RA = how much radius can shrink
18
New cards
What’s the difference between resilience and toughness
resilience is ability of material to absorb energy during elastic deformation while toughness is amount of energy absorbed during fracture (brittle = small toughness, ductile = large toughness)
19
New cards
What’s the difference between true and engineering stress-strain?
engineering= original lo and Ao, true= instaneous lo and Ao
20
New cards
hardness
measure of resistance to surface plastic deformation
21
New cards
Rockwell hardness
standard force leads to measured depth, can measure large scale of hardness
22
New cards
Brinell Hardness
single scale (HB), can be related to tensile strength
23
New cards
Why do we need design/safety factors
because of design uncertainties, allowances must be made to protect against failure, so you assume material is weaker than it actually is
24
New cards
Plastic deformation from atomic perspective
Plastic deformation occurs by motion of dislocations (edge, screw, mixed) in process called slip, Applied shear stress can cause extra half-plane of atoms (and edge dislocation line) to move, and Atomic bonds broken and reformed along slip plane as  dislocation moves
25
New cards
what does slip system consist of?
slip plane (crystallographic plane on which slip occurs most easily, high planar density), and direction (crystallographic direction along which slip occurs most easily, high linear density)
26
New cards
Slip occurs when Ƭ*R*
exceeds critical resolved shear stress, highest shear yeild’s first
27
New cards
before rolling, grains are
\-grains equiaxed and randomly oriented, isotropic
28
New cards
after rolling, grains are
elongated in rolling direction, anisotropic
29
New cards
if dislocations can’t move
plastic deformation can’t occur
30
New cards
the easier it is to move dislocations,
the less strength and hardness the material has and vice versa
31
New cards
mechanisms for strengthening/hardening materials
decrease dislocation mobility, Grain size reduction, Solid solution strengthening, Strain hardening(cold working)
32
New cards
reducing grain size
increases grain boundary area, creates more barriers to dislocation motion, which in turn increases yield strength, tensile strength, and hardness
33
New cards
solid solution strengthening
smaller impurity pulls in neighbors (tensile strain) while large impurity pushes neighbors (compressive strain), both cancel tensile dislocation strain so higher shear stress required are to cause disl. motion
34
New cards
strain hardening (cold work)
deformation reduces cross sectional area, which increases strength and lowers ductility, dislocation density increases
35
New cards
heat treatment nullifies
effects of cold work (annealing)
36
New cards
three annealing stages
Recovery(reduction in disl. density and disl), Recrystallization(new smaller grains are formed), Grain Growth
37
New cards
Metals having small grains are
relatively strong and tough at low temperatures
38
New cards
Hot working is deformation _____*TR*
above
39
New cards
Cold working is deformation _____*TR*
below
40
New cards
fracture
separation into 2+ pieces in response to a static stress, accompanied by propagation of crack
41
New cards
ductile fracture
generally slower and accompanied by significant plastic deformation- fails with warning (1 piece)
42
New cards
brittle fracture
shatters like glass, multiple pieces, no plastic deformation/warning
43
New cards
what fracture is this
what fracture is this
brittle
44
New cards
what fracture is this
what fracture is this
ductile
45
New cards
microscopic flaws (cracks) always
exist in materials, magnitude of applied tensile stress amplified at the tips of these cracks
46
New cards
Kt
stress concentration factor, suggests avoiding sharp corners for safe design
47
New cards
stress concentration is higher for ___ cracks and lower for ___ cracks
sharp, blunted
48
New cards
crack propagation (and fracture) occurs when
*σm(*stress at crack tip*)* > *σc*(critical stress) for crack with lowest *σc*
49
New cards
Kc
fracture toughness
50
New cards
Kic
plane strain fracture toughness, high for ductile, low for brittle
51
New cards
Y
shape factor
52
New cards
what is the technique to quantify fracture toughness
Charpy impact test
53
New cards
fatigue failure
failure under lengthy period of repeated stress (stress varies with time), even though applied stress is less than yield strength, responsible for 90% of engineering fails
54
New cards
as T increases, impact energy
increases
55
New cards
Some BCC metals exhibit Ductile-to-Brittle Transition as
temperatures increase
56
New cards
Sfat
fatigue limit, no fatigue if *S(*stress amplitude) < *S*fat (theoretically safe forever)
57
New cards
two types of fatigue behavior
some materials have asymptotic fatigue limit while others don’t safe below curve of S vs N for both
58
New cards
fatigue life Nf
total # of stress cycles to cause fatigue failure at specified stress amplitude
59
New cards
three techniques for improving fatigue life
reducting mean stress Om, surface treatments (shot peening and carburizing), and design changes (removing stress concentrators-sharp corners)
60
New cards
shot peening
surface compressive stress due to plastic deformation of outer surface layer
61
New cards
carburizing
surface compressive stress due to carbon atoms diffusing into outer surface layer
62
New cards
explain creep deformation
Measure deformation (strain) vs. time at constant stress, Occurs at elevated temperature for most metals, *T* > 0.4 *Tm* (in K)
63
New cards
three stages of creep
Primary Creep (slope (creep rate) decreases with time), Secondary Creep (steady-state, constant slope (Δe /Δt), Tertiary Creep (slope increases with time, acceleration of rate)
64
New cards
with increasing temp and stress,
steady state creep rate increases and rupture lifetime decreases
65
New cards
how to predict time to rupture in creep without spending years in labs
increase temp for a lower time, use larson miller parameter m
66
New cards
components (phase diagram)
elements/compounds present
67
New cards
phase
physically and chemically distinct material regions
68
New cards
solution
solid, liquid, or gas, single phase
69
New cards
mixture
more than one phase
70
New cards
solubility limit
max conc. for which only a single phase solution exists
71
New cards
What 2 main factors affect the number of phases
changing temp and conc
72
New cards
phases are a function of
temp and conc(independent variables) and pressure (1 atm)
73
New cards
binary systems
just 2 components
74
New cards
isomorphous
complete solubility of one component in another (phase field extends from 0 to 100%)
75
New cards
Tie line
connects phases in equilibrium with each other (isotherm)
76
New cards
Binary Eutectic systems
2 components, has special comp. with a min melting temp, limited solubility
77
New cards
Hypoeutectic
below eutectic comp (α particles)
78
New cards
Hypereutectic
above eutectic comp (β particles)
79
New cards
eutectic
liquid phase to 2 solid phases
80
New cards
eutectoid
1 solid phase to 2 other solid phases
81
New cards
peritectic
1 liquid and 1 solid phase to a second solid phase
82
New cards
Fe3C
intermetallic compound cementite, hard
83
New cards
α
ferrite, soft
84
New cards
Pearlite
alt. layers of α and Fe3C layers
85
New cards
 **γ**
austenite- red hot steel
86
New cards
Hypoeutectoid steel
proeutectoid ferrite in gran boundaries
87
New cards
Hypereutectoid steel
proeutectoid cementite in grain boundaries
88
New cards
affects eutectoid temp and conc
alloying with other elements
89
New cards
nucleation
nuclei (seeds) act as template for crystal growth (addition of atoms to nucleus must be faster than loss), and once nucleated, growth continues until equilibrium is reached
90
New cards
as temp increases, driving force to nucleate
increases
91
New cards
kinetics
study of reaction rates of phase transformations
92
New cards
coarse pearlite
formed at higher temp, thick layers so relatively soft (low strength and ductile)
93
New cards
fine pearlite
formed at low temp, multiple thin layers so relatively hard (moderate strength and brittle)
94
New cards
Bainite
elongated Fe3C particles in α-ferrite matrix, diffusion controlled (moderate strength)
95
New cards
Spheroidite 
formed by heating bainite/pearlite at temp just below eutectoid for long times produces spherical Fe3C particles, so very soft and ductile
96
New cards
Martensite
single phase, has body-centered tetragonal structure, diffusion less transformation, very hard (high strength and brittle)
97
New cards
as carbon content increases
tensile and yield strength increase while ductility decreases
98
New cards
tempered martensite
heat treating martensite makes it less brittle, producing extremely small Fe3C particles surrounded by ferrite (high strength and ductile)
99
New cards
slow cooling austenite produces
pearlite( ferrite and cementite layers plus proeutectoid phase)
100
New cards
moderately cooling austenite produces
bainite